Shunxiang Lan

According to our database¹, Shunxiang Lan authored at least 3 papers between 2024 and 2025.

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2025

Equivalent Thermal Conductance Network (ETCN) Model for Domain Decomposition and Efficient Thermal Simulation of GaN HEMTs.

[BibT_eX]

[DOI]

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., June, 2025

Flexible Thermal Conductance Model (TCM) for Efficient Thermal Simulation of 3-D ICs and Packages.

[BibT_eX]

[DOI]

Proceedings of the Design, Automation & Test in Europe Conference, 2025

2024

Thermal Resistance Network Derivative (TREND) Model for Efficient Thermal Simulation and Design of ICs and Packages.

[BibT_eX]

[DOI]

Proceedings of the 61st ACM/IEEE Design Automation Conference, 2024