Liang Chen
Orcid: 0000-0002-5373-0328Affiliations:
- University of California, Riverside, Department of Electrical and Computer Engineering, CA, USA
- Shanghai Jiao Tong University, Department of electronic engineering, China (PhD 2020)
According to our database1,
Liang Chen
authored at least 17 papers
between 2020 and 2023.
Collaborative distances:
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Bibliography
2023
Thermoelectric Cooler Modeling and Optimization via Surrogate Modeling Using Implicit Physics-Constrained Neural Networks.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., November, 2023
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., November, 2023
Integr., March, 2023
PostPINN-EM: Fast Post-Voiding Electromigration Analysis Using Two-Stage Physics-Informed Neural Networks.
Proceedings of the IEEE/ACM International Conference on Computer Aided Design, 2023
Fast Full-Chip Parametric Thermal Analysis Based on Enhanced Physics Enforced Neural Networks.
Proceedings of the IEEE/ACM International Conference on Computer Aided Design, 2023
2022
Electrothermal Simulation and Optimal Design of Thermoelectric Cooler Using Analytical Approach.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2022
HierPINN-EM: Fast Learning-Based Electromigration Analysis for Multi-Segment Interconnects Using Hierarchical Physics-Informed Neural Network.
Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design, 2022
Proceedings of the 27th Asia and South Pacific Design Automation Conference, 2022
Proceedings of the 27th Asia and South Pacific Design Automation Conference, 2022
2021
Fast Physics-Based Electromigration Analysis for Full-Chip Networks by Efficient Eigenfunction-Based Solution.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2021
A Fast Semi-Analytic Approach for Combined Electromigration and Thermomigration Analysis for General Multisegment Interconnects.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2021
Robust power grid network design considering EM aging effects for multi-segment wires.
Integr., 2021
EMGraph: Fast Learning-Based Electromigration Analysis for Multi-Segment Interconnect Using Graph Convolution Networks.
Proceedings of the 58th ACM/IEEE Design Automation Conference, 2021
2020
IEEE Trans. Very Large Scale Integr. Syst., 2020
Proceedings of the MLCAD '20: 2020 ACM/IEEE Workshop on Machine Learning for CAD, 2020
Electromigration Immortality Check considering Joule Heating Effect for Multisegment Wires.
Proceedings of the IEEE/ACM International Conference On Computer Aided Design, 2020
An Adaptive Electromigration Assessment Algorithm for Full-chip Power/Ground Networks.
Proceedings of the 25th Asia and South Pacific Design Automation Conference, 2020