Shunxiang Lan

According to our database, Shunxiang Lan authored at least 5 papers between 2024 and 2026.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2026

Efficient Simulation of IC Packages with TEC Based on Adaptive Segmented Method and Spatially-Aware Thermal Neural Network.

Longfei Li, Xinyue Li, Shunxiang Lan, Liang Chen, Haibao Chen, Min Tang

Proceedings of the 31st Asia and South Pacific Design Automation Conference, 2026

Domain Transformation and Decomposition Method for Composable Thermal Modeling and Simulation of Chiplet-Based 2.5D Integrated System.

Shunxiang Lan, Min Tang

Proceedings of the 31st Asia and South Pacific Design Automation Conference, 2026

2025

Equivalent Thermal Conductance Network (ETCN) Model for Domain Decomposition and Efficient Thermal Simulation of GaN HEMTs.

Shunxiang Lan, Min Tang

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., June, 2025

Flexible Thermal Conductance Model (TCM) for Efficient Thermal Simulation of 3-D ICs and Packages.

Shunxiang Lan, Min Tang, Jun Ma

Proceedings of the Design, Automation & Test in Europe Conference, 2025

2024

Thermal Resistance Network Derivative (TREND) Model for Efficient Thermal Simulation and Design of ICs and Packages.

Shunxiang Lan, Min Tang, Liang Chen, Junfa Mao

Proceedings of the 61st ACM/IEEE Design Automation Conference, 2024