Soichiro Ibaraki

According to our database, Soichiro Ibaraki authored at least 2 papers between 2009 and 2013.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2013

Thermal design guideline and new cooling solution for a three-dimensional (3D) chip stack.

Keiji Matsumoto, Soichiro Ibaraki, Kuniaki Sueoka, Katsuyuki Sakuma, Hidekazu Kikuchi, Hiroyuki Mori, Yasumitsu Orii, Fumiaki Yamada, Kohei Fujihara, Junichi Takamatsu, Koji Kondo

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2009

Thermal resistance measurements of interconnections for a three-dimensional (3D) chip stack.

Keiji Matsumoto, Soichiro Ibaraki, Katsuyuki Sakuma, Fumiaki Yamada

Proceedings of the IEEE International Conference on 3D System Integration, 2009