Tassawar Hussain
Orcid: 0000-0002-8916-7135
According to our database1,
Tassawar Hussain
authored at least 2 papers
between 2021 and 2025.
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Bibliography
2025
Intermetallic Compounds (IMCs) Growth Investigation, Kinetic Parameter Analysis and Reliability Evaluation of In Solder Metal for 3D Integration Packaging.
IEEE J. Emerg. Sel. Topics Circuits Syst., September, 2025
2021
Highly Fast Response of Pd/Ta2O5/SiC and Pd/Ta2O5/Si Schottky Diode-Based Hydrogen Sensors.
Sensors, 2021