Ingrid De Wolf

According to our database, Ingrid De Wolf authored at least 66 papers between 2001 and 2023.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2023

Benchmarking of Machine Learning Methods for Multiscale Thermal Simulation of Integrated Circuits.

David Coenen, Herman Oprins, Robin Degraeve, Ingrid De Wolf

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., July, 2023

Coupled Dynamic Thermo-Optical Analysis and Compact Modelling of Self-Heating in Ring Modulator.

David Coenen, Minkyu Kim, Herman Oprins, Ingrid De Wolf, Yoojin Ban, Joris Van Campenhout

Proceedings of the International Conference on Photonics in Switching and Computing, 2023

Analysis of TDDB lifetime projection in low thermal budget HfO2/SiO2 stacks for sequential 3D integrations.

Andrea Vici, Robin Degraeve, Philippe J. Roussel, Jacopo Franco, Ben Kaczer, Ingrid De Wolf

Proceedings of the IEEE International Reliability Physics Symposium, 2023

Impact of via geometry and line extension on via-electromigration in nano-interconnects.

A. S. Saleh, Houman Zahedmanesh, Hajdin Ceric, Ingrid De Wolf, Kris Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2023

Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters.

Youqi Ding, O. Varela Pedreira, Melina Lofrano, Houman Zahedmanesh, T. Chavez, Hosain Farr, Ingrid De Wolf, Kris Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2023

2022

Combining SILC and BD statistics for low-voltage lifetime projection in HK/MG stacks.

Andrea Vici, Robin Degraeve, João Pedro Bastos, Philippe Roussel, Ingrid De Wolf

Proceedings of the IEEE International Reliability Physics Symposium, 2022

Significant Enhancement of HCD and TDDB in CMOS FETs by Mechanical Stress.

Kookjin Lee, Ben Kaczer, Anastasiia Kruv, Mario Gonzalez, Geert Eneman, Oguzhan O. Okudur, Alexander Grill, Jacopo Franco, Andrea Vici, Robin Degraeve, Ingrid De Wolf

Proceedings of the IEEE International Reliability Physics Symposium, 2022

Wafer-Level Aging of InGaAs/GaAs Nano-Ridge p-i-n Diodes Monolithically Integrated on Silicon.

Ping-Yi Hsieh, Artemisia Tsiara, Barry J. O'Sullivan, Didit Yudistira, Marina Baryshnikova, Guido Groeseneken, Bernardette Kunert, Marianna Pantouvaki, Joris Van Campenhout, Ingrid De Wolf

Proceedings of the IEEE International Reliability Physics Symposium, 2022

2021

Impact of mechanical strain on wakeup of HfO2 ferroelectric memory.

Anastasiia Kruv, Sean R. C. McMitchell, Sergiu Clima, Oguzhan O. Okudur, Nicolo Ronchi, Geert Van den Bosch, Mario Gonzalez, Ingrid De Wolf, Jan Van Houdt

Proceedings of the IEEE International Reliability Physics Symposium, 2021

Thermal source separation for 3D defect localization using independent component analysis (ICA) from time-resolved temperature response (TRTR).

Michael Kögel, Sebastian Brand, Christian Große, Kristof J. P. Jacobs, Ingrid De Wolf, Frank Altmann

Proceedings of the 17th IEEE International Conference on Automation Science and Engineering, 2021

2020

On the impact of mechanical stress on gate oxide trapping.

Anastasiia Kruv, Ben Kaczer, Alexander Grill, Mario Gonzalez, Jacopo Franco, Dimitri Linten, Wolfgang Goes, Tibor Grasser, Ingrid De Wolf

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

2019

Study of the Mechanical Stress Impact on Silicide Contact Resistance by 4-Point Bending.

Yefan Liu, Hao Yu, Gaspard Hiblot, Anastasiia Kruv, Marc Schaekers, Naoto Horiguchi, Dimitrios Velenis, Ingrid De Wolf

Proceedings of the IEEE International Reliability Physics Symposium, 2019

Impact of Mechanical Stress on the Electrical Performance of 3D NAND.

Anastasiia Kruv, Antonio Arreghini, Mario Gonzalez, Devin Verreck, Geert Van den Bosch, Ingrid De Wolf, Arnaud Furnémont

Proceedings of the IEEE International Reliability Physics Symposium, 2019

New Access to Soft Breakdown Parameters of Low-k Dielectrics Through Localisation-Based Analysis.

Norbert Herfurth, Anne Beyreuther, Elham Amini, Christian Boit, Michél Simon-Najasek, Susanne Hübner, Frank Altmann, R. Herfurth, Chen Wu, Ingrid De Wolf, Kris Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2019

Low-Frequency Noise Measurements to Characterize Cu-Electromigration Down to 44nm Metal Pitch.

Sofie Beyne, Olalla Varela Pedreira, Ingrid De Wolf, Zsolt Tökei, Kristof Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2019

2018

Detection of failure mechanisms in 24-40 nm FinFETs with (spectral) photon emission techniques using InGaAs camera.

Ivo Vogt, Tomonori Nakamura, Ingrid De Wolf, Christian Boit

Microelectron. Reliab., 2018

Photon emission as a characterization tool for bipolar parasitics in FinFET technology.

Anne Beyreuther, Norbert Herfurth, Elham Amini, Tomonori Nakamura, Ingrid De Wolf, Christian Boit

Microelectron. Reliab., 2018

Method to assess the impact of LER and spacing variation on BEOL dielectric reliability using 2D-field simulations for <20nm spacing.

Deniz Kocaay, Philippe Roussel, Kristof Croes, Ivan Ciofi, Alicja Lesniewska, Ingrid De Wolf

Proceedings of the IEEE International Reliability Physics Symposium, 2018

Stress mitigation of 3D-stacking/packaging induced stresses.

Kristof Croes, Vladimir Cherman, Melina Lofrano, Houman Zahedmanesh, Luka Kljucar, Mario Gonzalez, Ingrid De Wolf, Zsolt Tökei, Eric Beyne

Proceedings of the IEEE International Reliability Physics Symposium, 2018

The first observation of p-type electromigration failure in full ruthenium interconnects.

Sofie Beyne, Shibesh Dutta, Olalla Varela Pedreira, Niels Bosman, Christoph Adelmann, Ingrid De Wolf, Zsolt Tökei, Kristof Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2018

2017

LER and spacing variability on BEOL TDDB using E-field mapping: Impact of field acceleration.

Deniz Kocaay, Philippe Roussel, Kris Croes, Ivan Ciofi, Y. Saad, Ingrid De Wolf

Microelectron. Reliab., 2017

Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects.

Luka Kljucar, Mario Gonzalez, Kristof Croes, Ingrid De Wolf, Joke De Messemaeker, Gayle Murdoch, Philip Nolmans, Joeri De Vos, Jürgen Bömmels, Eric Beyne, Zsolt Tökei

Microelectron. Reliab., 2017

Study of GHz-SAM sensitivity to delamination in BEOL layers.

Ahmad Khaled, Luka Kljucar, Sebastian Brand, Michael Kögel, Robert Aertgeerts, Ruben Nicasy, Ingrid De Wolf

Microelectron. Reliab., 2017

Lock-in thermal laser stimulation for non-destructive failure localization in 3-D devices.

Kristof J. P. Jacobs, T. Wang, Michele Stucchi, Mario Gonzalez, Kris Croes, Ingrid De Wolf, Eric Beyne

Microelectron. Reliab., 2017

2016

Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line.

Luka Kljucar, Mario Gonzalez, Ingrid De Wolf, Kristof Croes, Jürgen Bömmels, Zsolt Tökei

Microelectron. Reliab., 2016

Investigating stress measurement capabilities of GHz Scanning Acoustic Microscopy for 3D failure analysis.

Ahmad Khaled, Sebastian Brand, Michael Kögel, Tim Appenroth, Ingrid De Wolf

Microelectron. Reliab., 2016

Copper Through Silicon Vias Studied by Photo-elastic Scanning Infrared Microscopy.

Martin Herms, Matthias Wagner, Ingrid De Wolf

Microelectron. Reliab., 2016

B-Spline X-Ray Diffraction Imaging - Rapid non-destructive measurement of die warpage in ball grid array packages.

Aidan Cowley, Andrej Ivankovic, C. S. Wong, N. S. Bennett, A. N. Danilewsky, Marcel Gonzalez, Vladimir Cherman, Bart Vandevelde, Ingrid De Wolf, Patrick J. McNally

Microelectron. Reliab., 2016

Reliability Challenges Related to TSV Integration and 3-D Stacking.

Kristof Croes, Joke De Messemaeker, Yunlong Li, Wei Guo, Olalla Varela Pedreira, Vladimir Cherman, Michele Stucchi, Ingrid De Wolf, Eric Beyne

IEEE Des. Test, 2016

50Gb/s C-band GeSi waveguide electro-absorption modulator.

S. A. Srinivasan, Peter Verheyen, R. Loo, Ingrid De Wolf, Marianna Pantouvaki, Guy Lepage, S. Balakrishnan, W. Vanherle, Philippe Absil, Joris Van Campenhout

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2016

New fast distributed thermal model for analysis of GaN based power devices.

Vice Sodan, Federica Lidia Teresa Maggioni, Herman Oprins, Steve Stoffels, Martine Baelmans, Ingrid De Wolf

Proceedings of the 46th European Solid-State Device Research Conference, 2016

2015

Microstructure simulation of grain growth in Cu through silicon vias using phase-field modeling.

Nabi Nabiollahi, Nele Moelans, Mario Gonzalez, Joke De Messemaeker, Christopher J. Wilson, Kristof Croes, Eric Beyne, Ingrid De Wolf

Microelectron. Reliab., 2015

Constant voltage electromigration for advanced BEOL copper interconnects.

Baojun Tang, Kris Croes, Nicolas Jourdan, Jürgen Bömmels, Zsolt Tökei, Ingrid De Wolf, Eric Wilcox, Timothy McMullen

Proceedings of the IEEE International Reliability Physics Symposium, 2015

Impact of oxide liner properties on TSV Cu pumping and TSV stress.

Joke De Messemaeker, O. Varela Pedreira, A. Moussa, Nabi Nabiollahi, Kris Vanstreels, Stefaan Van Huylenbroeck, Harold Philipsen, Patrick Verdonck, Bart Vandevelde, Ingrid De Wolf, Eric Beyne, Kris Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2015

Through silicon via to FinFET noise coupling in 3-D integrated circuits.

A. Rouhi Najaf Abadi, W. Guo, X. Sun, K. Ben Ali, Jean-Pierre Raskin, Martin Rack, C. Roda Neve, M. Choi, V. Moroz, Geert Van der Plas, Ingrid De Wolf, Eric Beyne, Philippe P. Absil

Proceedings of the 2015 International Conference on IC Design & Technology, 2015

2014

Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling.

Bart Vandevelde, Andrej Ivankovic, B. Debecker, Melina Lofrano, Kris Vanstreels, Wei Guo, Vladimir Cherman, Marcel Gonzalez, Geert Van der Plas, Ingrid De Wolf, Eric Beyne, Zsolt Tokei

Microelectron. Reliab., 2014

Sn whisker evaluations in 3D microbumped structures.

George Vakanas, Björn Vandecasteele, David Schaubroeck, Joke De Messemaeker, Geert Willems, Mark Ashworth, Geoffrey D. Wilcox, Ingrid De Wolf

Microelectron. Reliab., 2014

As-grown donor-like traps in low-k dielectrics and their impact on intrinsic TDDB reliability.

Baojun Tang, Kris Croes, Yohan Barbarin, Yunqi Wang, Robin Degraeve, Yunlong Li, Maria Toledano-Luque, Thomas Kauerauf, Jürgen Bömmels, Zsolt Tökei, Ingrid De Wolf

Microelectron. Reliab., 2014

Reliability challenges for barrier/liner system in high aspect ratio through silicon vias.

Yunlong Li, Stefaan Van Huylenbroeck, Els Van Besien, Xiaoping Shi, Chen Wu, Michele Stucchi, Gerald Beyer, Eric Beyne, Ingrid De Wolf, Kristof Croes

Microelectron. Reliab., 2014

Fast convolution based thermal model for 3D-ICs: Methodology, accuracy analysis and package impact.

F. L. T. Maggioni, Herman Oprins, Eric Beyne, Ingrid De Wolf, Martine Baelmans

Microelectron. J., 2014

2013

A novel method to measure the internal pressure of MEMS thin-film packages.

B. Wang, Jeroen De Coster, Martine Wevers, Ingrid De Wolf

Microelectron. Reliab., 2013

2012

MEMS packaging and reliability: An undividable couple.

Harrie A. C. Tilmans, Jeroen De Coster, Philippe Hélin, Vladimir Cherman, Anne Jourdain, Piet De Moor, Bart Vandevelde, Nga P. Pham, Joseph Zekry, Ann Witvrouw, Ingrid De Wolf

Microelectron. Reliab., 2012

Study of glass frit induced stiction using a micromirror array.

Fangzhou Ling, Jeroen De Coster, Ann Witvrouw, Jean-Pierre Celis, Ingrid De Wolf

Microelectron. Reliab., 2012

Effect of the functionalization process on the performance of SiGe MEM resonators used for bio-molecular sensing.

Ahmad Khaled, Moatassim Raoof, Vladimir Cherman, Karoline Jans, Mohammad Abbas, Shaker Ebrahim, Goerge Bryce, Peter Verheyen, Ann Witvrouw, Ingrid De Wolf

Microelectron. Reliab., 2012

Diffusion growth of Cu₃Sn phase in the bump and thin film Cu/Sn structures.

Biljana Dimcic, Riet Labie, Joke De Messemaeker, Kris Vanstreels, Kris Croes, Bert Verlinden, Ingrid De Wolf

Microelectron. Reliab., 2012

3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps.

Wei Guo, Geert Van der Plas, Andrej Ivankovic, Geert Eneman, Vladimir Cherman, Bart De Wachter, Abdelkarim Mercha, Mario Gonzalez, Yann Civale, Augusto Redolfi, Thibault Buisson, A. Jourdan, Bart Vandevelde, Kenneth J. Rebibis, Ingrid De Wolf, Antonio La Manna, Gerald Beyer, Eric Beyne, Bart Swinnen

Proceedings of the IEEE International Conference on IC Design & Technology, 2012

2011

Cu pumping in TSVs: Effect of pre-CMP thermal budget.

Ingrid De Wolf, Kris Croes, O. Varela Pedreira, Riet Labie, Augusto Redolfi, M. Van De Peer, Kris Vanstreels, C. Okoro, Bart Vandevelde, Eric Beyne

Microelectron. Reliab., 2011

Outgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS.

Bo Wang, Shuji Tanaka, B. Guo, G. Vereecke, Simone Severi, Ann Witvrouw, Martine Wevers, Ingrid De Wolf

Microelectron. Reliab., 2011

Influence of test structure design on stress-induced-voiding using an experimentally validated Finite Element Modeling approach.

Melina Lofrano, Kris Croes, Ingrid De Wolf, Christopher J. Wilson

Microelectron. Reliab., 2011

Thermal optimization of GaN-on-Si HEMTs with plastic package.

Rui Liu, Dominique M. M.-P. Schreurs, Walter De Raedt, Frederik Vanaverbeke, Robert Mertens, Ingrid De Wolf

Microelectron. Reliab., 2011

Electrical characterization and reliability study of integrated GaN power amplifier in multi-layer thin-film technology.

Rui Liu, Dominique M. M.-P. Schreurs, Walter De Raedt, Frederik Vanaverbeke, J. Das, Robert Mertens, Ingrid De Wolf

Microelectron. Reliab., 2011

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology.

Geert Van der Plas, Paresh Limaye, Igor Loi, Abdelkarim Mercha, Herman Oprins, Cristina Torregiani, Steven Thijs, Dimitri Linten, Michele Stucchi, Guruprasad Katti, Dimitrios Velenis, Vladimir Cherman, Bart Vandevelde, Veerle Simons, Ingrid De Wolf, Riet Labie, Dan Perry, Stephane Bronckers, Nikolaos Minas, Miro Cupac, Wouter Ruythooren, Jan Van Olmen, Alain Phommahaxay, Muriel de Potter de ten Broeck, Ann Opdebeeck, Michal Rakowski, Bart De Wachter, Morin Dehan, Marc Nelis, Rahul Agarwal, Antonio Pullini, Federico Angiolini, Luca Benini, Wim Dehaene, Youssef Travaly, Eric Beyne, Paul Marchal

IEEE J. Solid State Circuits, 2011

Analysis of microbump induced stress effects in 3D stacked IC technologies.

Andrej Ivankovic, Geert Van der Plas, V. Moroz, M. Choi, Vladimir Cherman, Abdelkarim Mercha, Paul Marchal, Marcel Gonzalez, Geert Eneman, Wenqi Zhang, Thibault Buisson, Mikael Detalle, Antonio La Manna, Diederik Verkest, Gerald Beyer, Eric Beyne, Bart Vandevelde, Ingrid De Wolf, Dirk Vandepitte

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

In-line metrology and inspection for process control during 3D stacking of IC's.

Sandip Halder, Ingrid De Wolf, Alain Phommahaxay, Andy Miller, Mireille Maenhoudt, Gerald Beyer, Bart Swinnen, Eric Beyne

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

Processing assessment and adhesion evaluation of copper through-silicon vias (TSVs) for three-dimensional stacked-integrated circuit (3D-SIC) architectures.

Y. Yang, Riet Labie, F. Ling, C. Zhao, A. Radisic, Jan Van Olmen, Youssef Travaly, Bert Verlinden, Ingrid De Wolf

Microelectron. Reliab., 2010

Impact of design factors and environment on the ESD sensitivity of MEMS micromirrors.

Sandeep Sangameswaran, Jeroen De Coster, Guido Groeseneken, Ingrid De Wolf

Microelectron. Reliab., 2010

Design issues and considerations for low-cost 3D TSV IC technology.

Geert Van der Plas, Paresh Limaye, Abdelkarim Mercha, Herman Oprins, Cristina Torregiani, Steven Thijs, Dimitri Linten, Michele Stucchi, Guruprasad Katti, Dimitrios Velenis, Domae Shinichi, Vladimir Cherman, Bart Vandevelde, Veerle Simons, Ingrid De Wolf, Riet Labie, Dan Perry, Stephane Bronckers, Nikolaos Minas, Miro Cupac, Wouter Ruythooren, Jan Van Olmen, Alain Phommahaxay, Muriel de Potter de ten Broeck, Ann Opdebeeck, Michal Rakowski, Bart De Wachter, Morin Dehan, Marc Nelis, Rahul Agarwal, Wim Dehaene, Youssef Travaly, Pol Marchal, Eric Beyne

Proceedings of the IEEE International Solid-State Circuits Conference, 2010

3D integration: Circuit design, test, and reliability challenges.

Nikolaos Minas, Ingrid De Wolf, Erik Jan Marinissen, Michele Stucchi, Herman Oprins, Abdelkarim Mercha, Geert Van der Plas, Dimitrios Velenis, Pol Marchal

Proceedings of the 16th IEEE International On-Line Testing Symposium (IOLTS 2010), 2010

2008

Detection of failure sites by focused ion beam and nano-probing in the interconnect of three-dimensional stacked circuit structures.

Yu Yang, Hugo Bender, Kai Arstila, Bart Swinnen, Bert Verlinden, Ingrid De Wolf

Microelectron. Reliab., 2008

Charging and discharging phenomena in electrostatically-driven single-crystal-silicon MEM resonators: DC bias dependence and influence on the series resonance frequency.

Stanislaw Kalicinski, Martine Wevers, Ingrid De Wolf

Microelectron. Reliab., 2008

Editorial.

Guido Groeseneken, Ingrid De Wolf, A. J. Mouthaan, Jaap Bisschop

Microelectron. Reliab., 2008

2004

Creep as a reliability problem in MEMS.

Robert Modlinski, Ann Witvrouw, Petar Ratchev, Anne Jourdain, Veerle Simons, H. A. C. Tilmans, Jaap M. J. den Toonder, Robert Puers, Ingrid De Wolf

Microelectron. Reliab., 2004

2003

MEMS reliability.

Ingrid De Wolf

Microelectron. Reliab., 2003

2002

Techniques to study the reliability of metal RF MEMS capacitive switches.

Ingrid De Wolf, W. Merlijn van Spengen

Microelectron. Reliab., 2002

2001

Spectroscopic photon emission microscopy: a unique tool for failure analysis of microelectronics devices.

Ingrid De Wolf, Mahmoud Rasras

Microelectron. Reliab., 2001

Investigation of stress in shallow trench isolation using UV micro-Raman spectroscopy.

Kai F. Dombrowski, B. Dietrich, Ingrid De Wolf, R. Rooyackers, G. Badenes

Microelectron. Reliab., 2001