Ingrid De Wolf

According to our database1, Ingrid De Wolf authored at least 61 papers between 2001 and 2022.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

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PhD thesis 
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Links

On csauthors.net:

Bibliography

2022
Combining SILC and BD statistics for low-voltage lifetime projection in HK/MG stacks.
Proceedings of the IEEE International Reliability Physics Symposium, 2022

Significant Enhancement of HCD and TDDB in CMOS FETs by Mechanical Stress.
Proceedings of the IEEE International Reliability Physics Symposium, 2022

Wafer-Level Aging of InGaAs/GaAs Nano-Ridge p-i-n Diodes Monolithically Integrated on Silicon.
Proceedings of the IEEE International Reliability Physics Symposium, 2022

2021
Impact of mechanical strain on wakeup of HfO2 ferroelectric memory.
Proceedings of the IEEE International Reliability Physics Symposium, 2021

Thermal source separation for 3D defect localization using independent component analysis (ICA) from time-resolved temperature response (TRTR).
Proceedings of the 17th IEEE International Conference on Automation Science and Engineering, 2021

2020
On the impact of mechanical stress on gate oxide trapping.
Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

2019
Study of the Mechanical Stress Impact on Silicide Contact Resistance by 4-Point Bending.
Proceedings of the IEEE International Reliability Physics Symposium, 2019

Impact of Mechanical Stress on the Electrical Performance of 3D NAND.
Proceedings of the IEEE International Reliability Physics Symposium, 2019

New Access to Soft Breakdown Parameters of Low-k Dielectrics Through Localisation-Based Analysis.
Proceedings of the IEEE International Reliability Physics Symposium, 2019

Low-Frequency Noise Measurements to Characterize Cu-Electromigration Down to 44nm Metal Pitch.
Proceedings of the IEEE International Reliability Physics Symposium, 2019

2018
Detection of failure mechanisms in 24-40 nm FinFETs with (spectral) photon emission techniques using InGaAs camera.
Microelectron. Reliab., 2018

Photon emission as a characterization tool for bipolar parasitics in FinFET technology.
Microelectron. Reliab., 2018

Method to assess the impact of LER and spacing variation on BEOL dielectric reliability using 2D-field simulations for <20nm spacing.
Proceedings of the IEEE International Reliability Physics Symposium, 2018

Stress mitigation of 3D-stacking/packaging induced stresses.
Proceedings of the IEEE International Reliability Physics Symposium, 2018

The first observation of p-type electromigration failure in full ruthenium interconnects.
Proceedings of the IEEE International Reliability Physics Symposium, 2018

2017
LER and spacing variability on BEOL TDDB using E-field mapping: Impact of field acceleration.
Microelectron. Reliab., 2017

Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects.
Microelectron. Reliab., 2017

Study of GHz-SAM sensitivity to delamination in BEOL layers.
Microelectron. Reliab., 2017

Lock-in thermal laser stimulation for non-destructive failure localization in 3-D devices.
Microelectron. Reliab., 2017

2016
Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line.
Microelectron. Reliab., 2016

Investigating stress measurement capabilities of GHz Scanning Acoustic Microscopy for 3D failure analysis.
Microelectron. Reliab., 2016

Copper Through Silicon Vias Studied by Photo-elastic Scanning Infrared Microscopy.
Microelectron. Reliab., 2016

B-Spline X-Ray Diffraction Imaging - Rapid non-destructive measurement of die warpage in ball grid array packages.
Microelectron. Reliab., 2016

Reliability Challenges Related to TSV Integration and 3-D Stacking.
IEEE Des. Test, 2016

50Gb/s C-band GeSi waveguide electro-absorption modulator.
Proceedings of the Optical Fiber Communications Conference and Exhibition, 2016

New fast distributed thermal model for analysis of GaN based power devices.
Proceedings of the 46th European Solid-State Device Research Conference, 2016

2015
Microstructure simulation of grain growth in Cu through silicon vias using phase-field modeling.
Microelectron. Reliab., 2015

Constant voltage electromigration for advanced BEOL copper interconnects.
Proceedings of the IEEE International Reliability Physics Symposium, 2015

Impact of oxide liner properties on TSV Cu pumping and TSV stress.
Proceedings of the IEEE International Reliability Physics Symposium, 2015

Through silicon via to FinFET noise coupling in 3-D integrated circuits.
Proceedings of the 2015 International Conference on IC Design & Technology, 2015

2014
Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling.
Microelectron. Reliab., 2014

Sn whisker evaluations in 3D microbumped structures.
Microelectron. Reliab., 2014

As-grown donor-like traps in low-k dielectrics and their impact on intrinsic TDDB reliability.
Microelectron. Reliab., 2014

Reliability challenges for barrier/liner system in high aspect ratio through silicon vias.
Microelectron. Reliab., 2014

Fast convolution based thermal model for 3D-ICs: Methodology, accuracy analysis and package impact.
Microelectron. J., 2014

2013
A novel method to measure the internal pressure of MEMS thin-film packages.
Microelectron. Reliab., 2013

2012
MEMS packaging and reliability: An undividable couple.
Microelectron. Reliab., 2012

Study of glass frit induced stiction using a micromirror array.
Microelectron. Reliab., 2012

Effect of the functionalization process on the performance of SiGe MEM resonators used for bio-molecular sensing.
Microelectron. Reliab., 2012

Diffusion growth of Cu<sub>3</sub>Sn phase in the bump and thin film Cu/Sn structures.
Microelectron. Reliab., 2012

3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps.
Proceedings of the IEEE International Conference on IC Design & Technology, 2012

2011
Cu pumping in TSVs: Effect of pre-CMP thermal budget.
Microelectron. Reliab., 2011

Outgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS.
Microelectron. Reliab., 2011

Influence of test structure design on stress-induced-voiding using an experimentally validated Finite Element Modeling approach.
Microelectron. Reliab., 2011

Thermal optimization of GaN-on-Si HEMTs with plastic package.
Microelectron. Reliab., 2011

Electrical characterization and reliability study of integrated GaN power amplifier in multi-layer thin-film technology.
Microelectron. Reliab., 2011

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology.
IEEE J. Solid State Circuits, 2011

Analysis of microbump induced stress effects in 3D stacked IC technologies.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

In-line metrology and inspection for process control during 3D stacking of IC's.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010
Processing assessment and adhesion evaluation of copper through-silicon vias (TSVs) for three-dimensional stacked-integrated circuit (3D-SIC) architectures.
Microelectron. Reliab., 2010

Impact of design factors and environment on the ESD sensitivity of MEMS micromirrors.
Microelectron. Reliab., 2010


3D integration: Circuit design, test, and reliability challenges.
Proceedings of the 16th IEEE International On-Line Testing Symposium (IOLTS 2010), 2010

2008
Detection of failure sites by focused ion beam and nano-probing in the interconnect of three-dimensional stacked circuit structures.
Microelectron. Reliab., 2008

Charging and discharging phenomena in electrostatically-driven single-crystal-silicon MEM resonators: DC bias dependence and influence on the series resonance frequency.
Microelectron. Reliab., 2008

Editorial.
Microelectron. Reliab., 2008

2004
Creep as a reliability problem in MEMS.
Microelectron. Reliab., 2004

2003
MEMS reliability.
Microelectron. Reliab., 2003

2002
Techniques to study the reliability of metal RF MEMS capacitive switches.
Microelectron. Reliab., 2002

2001
Spectroscopic photon emission microscopy: a unique tool for failure analysis of microelectronics devices.
Microelectron. Reliab., 2001

Investigation of stress in shallow trench isolation using UV micro-Raman spectroscopy.
Microelectron. Reliab., 2001


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