Jaber Derakhshandeh

According to our database, Jaber Derakhshandeh authored at least 5 papers between 2010 and 2023.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2023

IP Session on Chiplet: Design, Assembly, and Test.

Bapi Vinnakota, Jaber Derakhshandeh, Eric Beyne, Erik Jan Marinissen, Sreejit Chakravarty

Proceedings of the 41st IEEE VLSI Test Symposium, 2023

2019

Process Complexity and Cost Considerations of Multi-Layer Die Stacks.

Dimitrios Velenis, Joeri De Vos, Soon-Wook Kim, Jaber Derakhshandeh, Pieter Bex, Giovanni Capuz, Samuel Suhard, Kenneth June Rebibis, Stefaan Van Huylenbroeck, Erik Jan Marinissen, Alain Phommahaxay, Andy Miller, Gerald Beyer, Geert Van der Plas, Eric Beyne

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2016

Die to wafer 3D stacking for below 10um pitch microbumps.

Jaber Derakhshandeh, Lin Hou, Inge De Preter, Carine Gerets, Samuel Suhard, Vikas Dubey, Geraldine Jamieson, Fumihiro Inoue, Tomas Webers, Pieter Bex, Giovanni Capuz, Eric Beyne, John Slabbekoorn, Teng Wang, Anne Jourdain, Gerald Beyer, Kenneth June Rebibis, Andy Miller

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2014

Single-Grain Si Thin-Film Transistors for Monolithic 3D-ICs and Flexible Electronics.

Ryoichi Ishihara, Jin Zhang, Miki Trifunovic, Jaber Derakhshandeh, Negin Golshani, Daniel M. R. Tajari Mofrad, Tao Chen, Kees Beenakker, Tatsuya Shimoda

IEICE Trans. Electron., 2014

2010

Monolithic 3D integration of SRAM and image sensor using two layers of single grain silicon.

Negin Golshani, Jaber Derakhshandeh, Ryoichi Ishihara, C. I. M. Beenakker, Michael Robertson, Thomas Morrison

Proceedings of the IEEE International Conference on 3D System Integration, 2010