Thomas Vervust

According to our database, Thomas Vervust authored at least 8 papers between 2013 and 2021.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2021

Fully Integrated Flexible Dielectric Monitoring Sensor System for Real-Time In Situ Prediction of the Degree of Cure and Glass Transition Temperature of an Epoxy Resin.

Yang Yang, Bart Plovie, Gabriele Chiesura, Thomas Vervust, Lode Daelemans, Diana-Elena Mogosanu, Pieter Wuytens, Karen De Clerck, Jan Vanfleteren

IEEE Trans. Instrum. Meas., 2021

Correction to: The Augmented Movement Platform For Embodied Learning (AMPEL): development and reliability.

Lousin Moumdjian, Thomas Vervust, Joren Six, Ivan Schepers, Micheline Lesaffre, Peter Feys, Marc Leman

J. Multimodal User Interfaces, 2021

The Augmented Movement Platform For Embodied Learning (AMPEL): development and reliability.

Lousin Moumdjian, Thomas Vervust, Joren Six, Ivan Schepers, Micheline Lesaffre, Peter Feys, Marc Leman

J. Multimodal User Interfaces, 2021

2019

Design Automation of Meandered Interconnects for Stretchable Circuits.

Bart Plovie, Jan Vanfleteren, Thomas Vervust, Andrés Vásquez Quintero, Frederick Bossuyt

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2019

2016

Capacitive sensor network for composites production monitoring.

Yang Yang, Bart Plovie, Thomas Vervust, Jan Vanfleteren

Proceedings of the 2016 IEEE SENSORS, Orlando, FL, USA, October 30 - November 3, 2016, 2016

2015

Impact of geometry on stretchable meandered interconnect uniaxial tensile extension fatigue reliability.

Michal Jablonski, Riccardo Lucchini, Frederick Bossuyt, Thomas Vervust, Jan Vanfleteren, J. W. C. DeVries, Pasquale Vena, Mario Gonzalez

Microelectron. Reliab., 2015

2014

Vision: smart home control with head-mounted sensors for vision and brain activity.

Pieter Simoens, Elias De Coninck, Thomas Vervust, Jan-Frederik Van Wijmeersch, Tom Ingelbinck, Tim Verbelen, Maaike Op de Beeck, Bart Dhoedt

Proceedings of the Fifth International Workshop on Mobile Cloud Computing & Services, 2014

2013

Reliability of a stretchable interconnect utilizing terminated, in-plane meandered copper conductor.

Michal Jablonski, Frederick Bossuyt, Jan Vanfleteren, Thomas Vervust, H. de Vries

Microelectron. Reliab., 2013