Mario Gonzalez

According to our database, Mario Gonzalez authored at least 22 papers between 2006 and 2022.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2022

Significant Enhancement of HCD and TDDB in CMOS FETs by Mechanical Stress.

Kookjin Lee, Ben Kaczer, Anastasiia Kruv, Mario Gonzalez, Geert Eneman, Oguzhan O. Okudur, Alexander Grill, Jacopo Franco, Andrea Vici, Robin Degraeve, Ingrid De Wolf

Proceedings of the IEEE International Reliability Physics Symposium, 2022

2021

Impact of mechanical strain on wakeup of HfO2 ferroelectric memory.

Anastasiia Kruv, Sean R. C. McMitchell, Sergiu Clima, Oguzhan O. Okudur, Nicolo Ronchi, Geert Van den Bosch, Mario Gonzalez, Ingrid De Wolf, Jan Van Houdt

Proceedings of the IEEE International Reliability Physics Symposium, 2021

2020

On the impact of mechanical stress on gate oxide trapping.

Anastasiia Kruv, Ben Kaczer, Alexander Grill, Mario Gonzalez, Jacopo Franco, Dimitri Linten, Wolfgang Goes, Tibor Grasser, Ingrid De Wolf

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

Toward Accessible Mobile Application Development for Users with Low Vision.

Patricia Acosta-Vargas, Luis Serrano-Costales, Luis Salvador-Ullauri, Isabel L. Nunes, Mario Gonzalez

Proceedings of the Advances in Human Factors and Systems Interaction, 2020

2019

Impact of Mechanical Stress on the Electrical Performance of 3D NAND.

Anastasiia Kruv, Antonio Arreghini, Mario Gonzalez, Devin Verreck, Geert Van den Bosch, Ingrid De Wolf, Arnaud Furnémont

Proceedings of the IEEE International Reliability Physics Symposium, 2019

Improving Web Accessibility: Evaluation and Analysis of a Telerehabilitation Platform for Hip Arthroplasty Patients.

Patricia Acosta-Vargas, Luis Salvador-Ullauri, Jorge Luis Pérez-Medina, Mario Gonzalez, Karina Jimenes, Yves Rybarczyk

Proceedings of the Advances in Human Factors and Systems Interaction, 2019

2018

Enhanced Cu pillar design to reduce thermomechanical stress induced during flip chip assembly.

Melina Lofrano, Vladimir Cherman, Mario Gonzalez, Eric Beyne

Microelectron. Reliab., 2018

Stress mitigation of 3D-stacking/packaging induced stresses.

Kristof Croes, Vladimir Cherman, Melina Lofrano, Houman Zahedmanesh, Luka Kljucar, Mario Gonzalez, Ingrid De Wolf, Zsolt Tökei, Eric Beyne

Proceedings of the IEEE International Reliability Physics Symposium, 2018

2017

Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects.

Luka Kljucar, Mario Gonzalez, Kristof Croes, Ingrid De Wolf, Joke De Messemaeker, Gayle Murdoch, Philip Nolmans, Joeri De Vos, Jürgen Bömmels, Eric Beyne, Zsolt Tökei

Microelectron. Reliab., 2017

Lock-in thermal laser stimulation for non-destructive failure localization in 3-D devices.

Kristof J. P. Jacobs, T. Wang, Michele Stucchi, Mario Gonzalez, Kris Croes, Ingrid De Wolf, Eric Beyne

Microelectron. Reliab., 2017

2016

Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; a numerical investigation.

Houman Zahedmanesh, Mario Gonzalez, Ivan Ciofi, Kristof Croes, Jürgen Bömmels, Zsolt Tökei

Microelectron. Reliab., 2016

Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line.

Luka Kljucar, Mario Gonzalez, Ingrid De Wolf, Kristof Croes, Jürgen Bömmels, Zsolt Tökei

Microelectron. Reliab., 2016

Managing Quality of Service in Wireless Body Area Networks using CoAP.

Ehsan Monsef, Mario Gonzalez, Won-Jae Yi, Jafar Saniie

Proceedings of the 2016 IEEE International Conference on Electro Information Technology, 2016

2015

Microstructure simulation of grain growth in Cu through silicon vias using phase-field modeling.

Nabi Nabiollahi, Nele Moelans, Mario Gonzalez, Joke De Messemaeker, Christopher J. Wilson, Kristof Croes, Eric Beyne, Ingrid De Wolf

Microelectron. Reliab., 2015

Impact of geometry on stretchable meandered interconnect uniaxial tensile extension fatigue reliability.

Michal Jablonski, Riccardo Lucchini, Frederick Bossuyt, Thomas Vervust, Jan Vanfleteren, J. W. C. DeVries, Pasquale Vena, Mario Gonzalez

Microelectron. Reliab., 2015

Nonexistent harmonics generation phenomenon caused by the processing of DQ transformation in power quality applications.

Mario Gonzalez, Victor M. Cárdenas, Ricardo Alvarez

Proceedings of the IEEE International Conference on Industrial Technology, 2015

Metallization scheme optimization of plastic-encapsulated electronic power devices.

Jan Ackaert, Tony Colpaert, Aditi Malik, Mario Gonzalez

Proceedings of the 2015 International Conference on IC Design & Technology, 2015

2012

3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps.

Wei Guo, Geert Van der Plas, Andrej Ivankovic, Geert Eneman, Vladimir Cherman, Bart De Wachter, Abdelkarim Mercha, Mario Gonzalez, Yann Civale, Augusto Redolfi, Thibault Buisson, A. Jourdan, Bart Vandevelde, Kenneth J. Rebibis, Ingrid De Wolf, Antonio La Manna, Gerald Beyer, Eric Beyne, Bart Swinnen

Proceedings of the IEEE International Conference on IC Design & Technology, 2012

2011

Design and implementation of flexible and stretchable systems.

Mario Gonzalez, Bart Vandevelde, Wim Christiaens, Yung-Yu Hsu, François Iker, Frederick Bossuyt, Jan Vanfleteren, Olaf van der Sluis, P. H. M. Timmermans

Microelectron. Reliab., 2011

2008

Design of metal interconnects for stretchable electronic circuits.

Mario Gonzalez, Fabrice Axisa, Mathieu Vanden Bulcke, Dominique Brosteaux, Bart Vandevelde, Jan Vanfleteren

Microelectron. Reliab., 2008

2007

Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages.

Bart Vandevelde, Mario Gonzalez, Paresh Limaye, Petar Ratchev, Eric Beyne

Microelectron. Reliab., 2007

2006

Active Electrode Arrays by Chip Embedding in a Flexible Silicone Carrier.

Mathieu Vanden Bulcke, Kris Baert, Eric Beyne, Mario Gonzalez, Christophe Winters, Tomas Webers

Proceedings of the 28th International Conference of the IEEE Engineering in Medicine and Biology Society, 2006