Thorsten Matthias

According to our database, Thorsten Matthias authored at least 3 papers between 2009 and 2013.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2013

Numerical analysis of draw bending of load-adapted sheet metal profiles.

Bernd-Arno Behrens, Anas Bouguecha, J. Rosenberger, Thorsten Matthias

Prod. Eng., 2013

Recent progress in thin wafer processing.

Thomas Uhrmann, Thorsten Matthias, Markus Wimplinger, Jurgen Burggraf, Daniel Burgstaller, Harald Wiesbauer, Paul Lindner

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2009

Advanced wafer bonding solutions for TSV integration with thin wafers.

Bioh Kim, Thorsten Matthias, Markus Wimplinger, Paul Lindner

Proceedings of the IEEE International Conference on 3D System Integration, 2009