Toni T. Mattila

According to our database, Toni T. Mattila authored at least 11 papers between 2007 and 2014.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2014

Evaluation of the drop response of handheld electronic products.

Toni T. Mattila, Laura Vajavaara, Jussi Hokka, Esa Hussa, Manu Mäkelä, Ville Halkola

Microelectron. Reliab., 2014

An approach to adjust the board-level drop test conditions to improve the correlation with product-level drop impact.

Toni T. Mattila, Heikki Ruotoistenmäki, Jani Raami, Jussi Hokka, Manu Mäkelä, Esa Hussa, Markku Sillanpää, Ville Halkola

Microelectron. Reliab., 2014

Reliability assessment of a MEMS microphone under mixed flowing gas environment and shock impact loading.

Jue Li, Mikael Broas, Jani Raami, Toni T. Mattila, Mervi Paulasto-Kröckel

Microelectron. Reliab., 2014

2012

On the effects of temperature on the drop reliability of electronic component boards.

Toni T. Mattila, Jue Li, Jorma K. Kivilahti

Microelectron. Reliab., 2012

Shock impact reliability characterization of a handheld product in accelerated tests and use environment.

Juha Karppinen, Jue Li, J. Pakarinen, Toni T. Mattila, Mervi Paulasto-Kröckel

Microelectron. Reliab., 2012

The reliability of component boards studied with different shock impact repetition frequencies.

Jussi Hokka, Jue Li, Toni T. Mattila, Mervi Paulasto-Kröckel

Microelectron. Reliab., 2012

2011

Toward comprehensive reliability assessment of electronics by a combined loading approach.

Toni T. Mattila, Mervi Paulasto-Kröckel

Microelectron. Reliab., 2011

2010

FEM simulations for reliability assessment of component boards drop tested at various temperatures.

J. Li, Toni T. Mattila, H. Xu, Mervi Paulasto

Simul. Model. Pract. Theory, 2010

Thermomechanical reliability characterization of a handheld product in accelerated tests and use environment.

Juha Karppinen, Jue Li, Toni T. Mattila, Mervi Paulasto-Kröckel

Microelectron. Reliab., 2010

A novel impact test system for more efficient reliability testing.

Jussi Hokka, Toni T. Mattila, Jue Li, Jarmo Teeri, Jorma K. Kivilahti

Microelectron. Reliab., 2010

2007

Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests.

Tomi Laurila, Toni T. Mattila, Vesa Vuorinen, Juha Karppinen, Jue Li, Mika Sippola, Jorma K. Kivilahti

Microelectron. Reliab., 2007