Tsung-Yueh Tsai

According to our database1, Tsung-Yueh Tsai authored at least 5 papers between 2007 and 2010.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of five.

Timeline

Legend:

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PhD thesis 
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Links

On csauthors.net:

Bibliography

2010
Early experience with in situ chip-to-chip alignment characterization of Proximity Communication flip-chip package.
Microelectron. Reliab., 2010

2009
High strain rate compression behavior for Sn-37Pb eutectic alloy, lead-free Sn-1Ag-0.5Cu and Sn-3Ag-0.5Cu alloys.
Microelectron. Reliab., 2009

2008
Structural design optimization for board-level drop reliability of wafer-level chip-scale packages.
Microelectron. Reliab., 2008

2007
Transient analysis of drop responses of board-level electronic packages using response spectra incorporated with modal superposition.
Microelectron. Reliab., 2007

Response spectra analysis for undamped structural systems subjected to half-sine impact acceleration pulses.
Microelectron. Reliab., 2007


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