Chang-Lin Yeh

According to our database, Chang-Lin Yeh authored at least 14 papers between 2005 and 2011.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2011

Characteristic of copper wire and transient analysis on wirebonding process.

Hsiang-Chen Hsu, Wei-Yao Chang, Chang-Lin Yeh, Yi-Shao Lai

Microelectron. Reliab., 2011

2008

Investigations of solder joint damage potentials for board-level chip-scale packages subjected to consecutive drops.

Chang-Lin Yeh, Yi-Shao Lai

Microelectron. Reliab., 2008

Structural design optimization for board-level drop reliability of wafer-level chip-scale packages.

Tsung-Yueh Tsai, Yi-Shao Lai, Chang-Lin Yeh, Rong-Sheng Chen

Microelectron. Reliab., 2008

Finite element model verification for packaged printed circuit board by experimental modal analysis.

Ying-Chih Lee, Bor-Tsuen Wang, Yi-Shao Lai, Chang-Lin Yeh, Rong-Sheng Chen

Microelectron. Reliab., 2008

Effects of different drop test conditions on board-level reliability of chip-scale packages.

Yi-Shao Lai, Po-Chuan Yang, Chang-Lin Yeh

Microelectron. Reliab., 2008

2007

Transient analysis of drop responses of board-level electronic packages using response spectra incorporated with modal superposition.

Chang-Lin Yeh, Tsung-Yueh Tsai, Yi-Shao Lai

Microelectron. Reliab., 2007

Empirical correlation between package-level ball impact test and board-level drop reliability.

Chang-Lin Yeh, Yi-Shao Lai, Hsiao-Chuan Chang, Tsan-Hsien Chen

Microelectron. Reliab., 2007

Response spectra analysis for undamped structural systems subjected to half-sine impact acceleration pulses.

Tsung-Yueh Tsai, Chang-Lin Yeh, Yi-Shao Lai, Rong-Sheng Chen

Microelectron. Reliab., 2007

Evaluation of solder joint strengths under ball impact test.

Yi-Shao Lai, Hsiao-Chuan Chang, Chang-Lin Yeh

Microelectron. Reliab., 2007

2006

Evaluation of board-level reliability of electronic packages under consecutive drops.

Chang-Lin Yeh, Yi-Shao Lai, Chin-Li Kao

Microelectron. Reliab., 2006

Transient fracturing of solder joints subjected to displacement-controlled impact loads.

Chang-Lin Yeh, Yi-Shao Lai

Microelectron. Reliab., 2006

Support excitation scheme for transient analysis of JEDEC board-level drop test.

Chang-Lin Yeh, Yi-Shao Lai

Microelectron. Reliab., 2006

Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition.

Yi-Shao Lai, Ping-Feng Yang, Chang-Lin Yeh

Microelectron. Reliab., 2006

2005

Transient analysis of the impact stage of wirebonding on Cu/low-K wafers.

Chang-Lin Yeh, Yi-Shao Lai

Microelectron. Reliab., 2005