Tung Thanh Bui
Orcid: 0000-0003-4628-059XAffiliations:
- Vietnam National University, VNU University of Engineering and Technology, Faculty of Electronics and Telecommunications, Hanoi, Vietnam
- National Institute of Advanced Industrial Science and Technology, AIST, 3D Integration System Group, Nanoelectronics Research Institute, NeRI, Tsukuba, Japan (2011-2015)
- Ritsumeikan University, Department of science and engineering, Shiga, Japan (PhD 2011)
According to our database1,
Tung Thanh Bui
authored at least 15 papers
between 2010 and 2023.
Collaborative distances:
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Bibliography
2023
Development of a Vision System to Enhance the Reliability of the Pick-and-Place Robot for Autonomous Testing of Camera Module used in Smartphones.
CoRR, 2023
An Enhanced Sampling-Based Method with Modified Next-Best View Strategy For 2D Autonomous Robot Exploration.
Proceedings of the 20th IEEE International Joint Conference on Computer Science and Software Engineering, 2023
A Sensor Fusion Approach for Improving Implementation Speed and Accuracy of RTAB-Map Algorithm Based Indoor 3D Mapping.
Proceedings of the 20th IEEE International Joint Conference on Computer Science and Software Engineering, 2023
Development of a Compact System to Recognize 26 Letters in American Sign Language Alphabet Based on Flexible Ionic Liquid Strain Sensors.
Proceedings of the 20th IEEE International Joint Conference on Computer Science and Software Engineering, 2023
A Highly Sensitive Immunosensor for White Spot Syndrome Virus (WSSV) Envelope Protein VP28 Detection Based on Electrochemical Impedance Spectroscopy Technique.
Proceedings of the 2023 IEEE SENSORS, Vienna, Austria, October 29 - Nov. 1, 2023, 2023
2021
A Wireless Passive Capacitively Coupled Contactless Conductivity Detection (WPC4D) for Microfluidic Flow Monitoring.
Proceedings of the 2021 IEEE Sensors, Sydney, Australia, October 31 - Nov. 3, 2021, 2021
2020
Biological Living Cell in-Flow Detection Based on Microfluidic Chip and Compact Signal Processing Circuit.
IEEE Trans. Biomed. Circuits Syst., 2020
Proceedings of the 2020 IEEE Sensors, Rotterdam, The Netherlands, October 25-28, 2020, 2020
2017
Proceedings of the 2017 IEEE SENSORS, Glasgow, United Kingdom, October 29, 2017
2016
Microelectron. Reliab., 2016
Proceedings of the 2016 IEEE SENSORS, Orlando, FL, USA, October 30 - November 3, 2016, 2016
Proceedings of the 2016 IEEE SENSORS, Orlando, FL, USA, October 30 - November 3, 2016, 2016
2015
Twice-etched silicon approach for via-last through-silicon-via with a Parylene-HT liner.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015
2014
Copper filled TSV formation with Parylene-HT insulator for low-temperature compatible 3D integration.
Proceedings of the 2014 International 3D Systems Integration Conference, 2014
2010