Fumiki Kato

According to our database, Fumiki Kato authored at least 4 papers between 2011 and 2021.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2021

High-speed switching operation for a SiC CMOS and power module.

Atsushi Yao, Mitsuo Okamoto, Fumiki Kato, Hiroshi Hozoji, Shinji Sato, Shinsuke Harada, Hiroshi Sato

IEICE Electron. Express, 2021

2014

Copper filled TSV formation with Parylene-HT insulator for low-temperature compatible 3D integration.

Bui Thanh Tung, Xiaojin Cheng, Naoya Watanabe, Fumiki Kato, Katsuya Kikuchi, Masahiro Aoyagi

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013

Investigation of optimized high-density flip-chip interconnect design including micro Au bumps for 3-D stacked LSI packaging.

Katsuya Kikuchi, Fumiki Kato, Shunsuke Nemoto, Hiroshi Nakagawa, Masahiro Aoyagi, Youtaro Yasu, Kohji Koshiji

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2011

Hot spots suppression by high thermal conductivity film in thin-sub strate CMOS ICs for 3D integration.

Fumiki Kato, Katsuya Kikuchi, Hiroshi Nakagawa, Masahiro Aoyagi

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011