Tvrtko Mandic
Orcid: 0000-0001-5913-7544
  According to our database1,
  Tvrtko Mandic
  authored at least 12 papers
  between 2009 and 2025.
  
  
Collaborative distances:
Collaborative distances:
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Bibliography
  2025
Autonomous Electromagnetic Simulation and Modeling of QFN Micro-Electronic Packages Using LLM Agents.
    
  
    IEEE Access, 2025
    
  
Stress-dependent MOSFET Model Valid in All Operating Regions For Use in Circuit Simulations.
    
  
    Proceedings of the IEEE International Symposium on Circuits and Systems, 2025
    
  
CMOS-Based Wheatstone Bridge Stress Sensors Sensitive and Insensitive to Mechanical Stress.
    
  
    Proceedings of the IEEE International Symposium on Circuits and Systems, 2025
    
  
  2024
Design and Verification Challenges in SoC Integration of PicoRV32 RISC-V with Sigma-Delta ADC.
    
  
    Proceedings of the 47th MIPRO ICT and Electronics Convention, 2024
    
  
  2020
Methodology for Characterization of Temperature and Power Losses of Inductors in DC/DC SMPS.
    
  
    Proceedings of the 27th IEEE International Conference on Electronics, Circuits and Systems, 2020
    
  
  2019
    Proceedings of the 42nd International Convention on Information and Communication Technology, 2019
    
  
  2017
Active-learning implementation proposal for course Electronics at undergraduate level.
    
  
    Proceedings of the 40th International Convention on Information and Communication Technology, 2017
    
  
  2015
    Proceedings of the 38th International Convention on Information and Communication Technology, 2015
    
  
    Proceedings of the 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, 2015
    
  
  2014
    Proceedings of the 37th International Convention on Information and Communication Technology, 2014
    
  
  2013
    Proceedings of the 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2013
    
  
  2009
Equivalent circuit model of the TEM cell electric and magnetic field coupling to microstrip lines.
    
  
    Proceedings of the 16th IEEE International Conference on Electronics, 2009