Tzu-Chun Hung

According to our database, Tzu-Chun Hung authored at least 2 papers in 2025.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2025

Void Formation Analysis in the Molded Underfill Process for Flip-Chip Packaging.

Ian Hu, Tzu-Chun Hung, Mu-Heng Zhou, Heng-Sheng Lin, Dao-Long Chen

Comput. Mater. Continua, 2025

Study on Dynamic Void Evolution During Transfer Molding Process of Flip Chip Package.

Ian Hu, Tzu-Chun Hung, Mu-Heng Zhou

Proceedings of the IEEE Industry Applications Society Annual Meeting, 2025