Ian Hu

According to our database¹, Ian Hu authored at least 2 papers in 2025.

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2025

Void Formation Analysis in the Molded Underfill Process for Flip-Chip Packaging.

[DOI]

Comput. Mater. Continua, 2025

Study on Dynamic Void Evolution During Transfer Molding Process of Flip Chip Package.

[DOI]

Proceedings of the IEEE Industry Applications Society Annual Meeting, 2025