W. K. Choi

According to our database, W. K. Choi authored at least 1 paper in 2011.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2011

A low stress bond pad design optimization of low temperature solder interconnections on TSVs for MEMS applications.

Xiaowu Zhang, Ranjan Rajoo, F. X. Che, C. S. Selvanayagam, W. K. Choi, Shan Gao, Guo-Qiang Lo, Dim-Lee Kwong

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011