Ranjan Rajoo

According to our database, Ranjan Rajoo authored at least 4 papers between 2003 and 2011.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2011

A low stress bond pad design optimization of low temperature solder interconnections on TSVs for MEMS applications.

Xiaowu Zhang, Ranjan Rajoo, F. X. Che, C. S. Selvanayagam, W. K. Choi, Shan Gao, Guo-Qiang Lo, Dim-Lee Kwong

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2008

Correlation studies for component level ball impact shear test and board level drop test.

Ee-Hua Wong, Ranjan Rajoo, S. K. W. Seah, C. S. Selvanayagam, W. D. van Driel, J. F. J. M. Caers, X. J. Zhao, N. Owens, L. C. Tan, M. Leoni, P. L. Eu, Y.-S. Lai, C.-L. Yeh

Microelectron. Reliab., 2008

2005

Development of process modeling methodology for flip chip on flex interconnections with non-conductive adhesives.

Xiaowu Zhang, Ee-Hua Wong, Ranjan Rajoo, Mahadevan K. Iyer, J. F. J. M. Caers, X. J. Zhao

Microelectron. Reliab., 2005

2003

Moisture absorption and diffusion characterisation of packaging materials--advanced treatment.

Ee-Hua Wong, Ranjan Rajoo

Microelectron. Reliab., 2003