X. Q. Shi

According to our database, X. Q. Shi authored at least 2 papers between 2003 and 2004.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2004

Investigation of long-term reliability and failure mechanism of solder interconnections with multifunctional micro-moiré interferometry system.

X. Q. Shi, John H. L. Pang, X. R. Zhang

Microelectron. Reliab., 2004

2003

A new methodology for the characterization of fracture toughness of filled epoxy films involved in microelectronics packages.

X. Q. Shi, Z. P. Wang, J. P. Pickering

Microelectron. Reliab., 2003