John H. L. Pang

According to our database, John H. L. Pang authored at least 8 papers between 2004 and 2020.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of three.

2020

A YOLOv3-based Deep Learning Application Research for Condition Monitoring of Rail Thermite Welded Joints.

Yang Liu, Xin Sun, John Hock Lye Pang

Proceedings of the IVSP '20: 2nd International Conference on Image, 2020

2015

Study on reliability of PQFP assembly with lead free solder joints under random vibration test.

F. X. Che, John H. L. Pang

Microelectron. Reliab., 2015

2009

Vibration reliability test and finite element analysis for flip chip solder joints.

F. X. Che, John H. L. Pang

Microelectron. Reliab., 2009

2008

The influence of solder volume and pad area on Sn-3.8Ag-0.7Cu and Ni UBM reaction in reflow soldering and isothermal aging.

C. K. Wong, John H. L. Pang, J. W. Tew, B. K. Lok, H. J. Lu, F. L. Ng, Y. F. Sun

Microelectron. Reliab., 2008

Digital image correlation for solder joint fatigue reliability in microelectronics packages.

Yaofeng Sun, John H. L. Pang

Microelectron. Reliab., 2008

2006

Modeling and simulation for a drop-impact analysis of multi-layered printed circuit boards.

Yuqi Wang, K. H. Low, John H. L. Pang, Kay Hiang Hoon, F. X. Che, Y. S. Yong

Microelectron. Reliab., 2006

Drop impact reliability testing for lead-free and lead-based soldered IC packages.

Desmond Y. R. Chong, F. X. Che, John H. L. Pang, Kellin Ng, Jane Y. N. Tan, Patrick T. H. Low

Microelectron. Reliab., 2006

2004

Investigation of long-term reliability and failure mechanism of solder interconnections with multifunctional micro-moiré interferometry system.

X. Q. Shi, John H. L. Pang, X. R. Zhang

Microelectron. Reliab., 2004