K. C. Hung

According to our database, K. C. Hung authored at least 7 papers between 2001 and 2002.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2002

Application of adhesive bonding techniques in hard disk drive head assembly.

C. F. Luk, Y. C. Chan, K. C. Hung

Microelectron. Reliab., 2002

Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies.

C. F. Luk, Y. C. Chan, K. C. Hung

Microelectron. Reliab., 2002

No-flow underfill flip chip assembly--an experimental and modeling analysis.

Hua Lu, K. C. Hung, Stoyan Stoyanov, Chris Bailey, Y. C. Chan

Microelectron. Reliab., 2002

Reliability study of the electroless Ni-P layer against solder alloy.

M. O. Alam, Yan Cheong Chan, K. C. Hung

Microelectron. Reliab., 2002

2001

Study of micro-BGA solder joint reliability.

P. L. Tu, Y. C. Chan, K. C. Hung, J. K. L. Lai

Microelectron. Reliab., 2001

Reliability of microBGA assembly using no-flow underfill.

P. L. Tu, Y. C. Chan, K. C. Hung

Microelectron. Reliab., 2001

Study of the self-alignment of no-flow underfill for micro-BGA assembly.

Y. C. Chan, P. L. Tu, K. C. Hung

Microelectron. Reliab., 2001