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K. C. Hung

According to our database1, K. C. Hung authored at least 7 papers between 2001 and 2002.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

Legend:

Book  In proceedings  Article  PhD thesis  Dataset  Other 

Links

On csauthors.net:

Bibliography

2002
Application of adhesive bonding techniques in hard disk drive head assembly.
[BibTeX]
[DOI]
C. F. Luk
,
Y. C. Chan
,
K. C. Hung
Microelectron. Reliab., 2002

Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies.
[BibTeX]
[DOI]
C. F. Luk
,
Y. C. Chan
,
K. C. Hung
Microelectron. Reliab., 2002

No-flow underfill flip chip assembly--an experimental and modeling analysis.
[BibTeX]
[DOI]
Hua Lu
,
K. C. Hung
,
Stoyan Stoyanov
,
Chris Bailey
,
Y. C. Chan
Microelectron. Reliab., 2002

Reliability study of the electroless Ni-P layer against solder alloy.
[BibTeX]
[DOI]
M. O. Alam
,
Yan Cheong Chan
,
K. C. Hung
Microelectron. Reliab., 2002

2001
Study of micro-BGA solder joint reliability.
[BibTeX]
[DOI]
P. L. Tu
,
Y. C. Chan
,
K. C. Hung
,
J. K. L. Lai
Microelectron. Reliab., 2001

Reliability of microBGA assembly using no-flow underfill.
[BibTeX]
[DOI]
P. L. Tu
,
Y. C. Chan
,
K. C. Hung
Microelectron. Reliab., 2001

Study of the self-alignment of no-flow underfill for micro-BGA assembly.
[BibTeX]
[DOI]
Y. C. Chan
,
P. L. Tu
,
K. C. Hung
Microelectron. Reliab., 2001


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