Yi-Wun Wang

According to our database, Yi-Wun Wang authored at least 2 papers between 2009 and 2011.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2011

Investigation of growth behavior of Al-Cu intermetallic compounds in Cu wire bonding.

Jiunn Chen, Yi-Shao Lai, Yi-Wun Wang, C. Robert Kao

Microelectron. Reliab., 2011

2009

Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates.

Yi-Wun Wang, Y. W. Lin, C. Robert Kao

Microelectron. Reliab., 2009