C. Robert Kao

Orcid: 0000-0001-6685-0639

According to our database¹, C. Robert Kao authored at least 6 papers between 2009 and 2020.

Collaborative distances:

Dijkstra number² of five.
Erdős number³ of five.

Timeline

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Article

PhD thesis

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Bibliography

2020

Low-Cost Sensor-Rich Fluidic Elastomer Actuators Embedded with Paper Electronics.

[BibT_eX]

[DOI]

Adv. Intell. Syst., 2020

2019

Hydrolysis-Tolerant Hybrid Bonding in Ambient Atmosphere for 3D Integration.

[BibT_eX]

[DOI]

Akitsu Shigetou

Tilo H. Yang

C. Robert Kao

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2013

Reliability of micro-interconnects in 3D IC packages.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2013

Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2013

2011

Investigation of growth behavior of Al-Cu intermetallic compounds in Cu wire bonding.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2011

2009

Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates.

[BibT_eX]

[DOI]

Yi-Wun Wang

Y. W. Lin

C. Robert Kao

Microelectron. Reliab., 2009

C. Robert Kao

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