Yong-Sung Eom

According to our database1, Yong-Sung Eom authored at least 2 papers between 2017 and 2019.

Collaborative distances:
  • Dijkstra number2 of six.
  • Erdős number3 of five.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
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Links

On csauthors.net:

Bibliography

2019
Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration.
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2017
Evaluating the material properties of underfill for a reliable 3D TSV integration package using numerical analysis.
Microelectron. Reliab., 2017


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