Jiho Joo

According to our database, Jiho Joo authored at least 5 papers between 2014 and 2019.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2019

Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration.

Kwang-Seong Choi, Yong-Sung Eom, Seok Hwan Moon, Jiho Joo, Kwangjoo Lee, Jung Hak Kim, Ju Hyeon Kim

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2018

25-Gb/s Clocked Pluggable Optics for High-Density Data Center Interconnections.

Gyu-Seob Jeong, Jeongho Hwang, Hong-Seok Choi, Hyungrok Do, Daehyun Koh, Daeyoung Yun, Jinhyung Lee, Kwanseo Park, Han-Gon Ko, Kwangho Lee, Jiho Joo, Gyungock Kim, Deog-Kyoon Jeong

IEEE Trans. Circuits Syst. II Express Briefs, 2018

A 32 Gb/s, 201 mW, MZM/EAM Cascode Push-Pull CML Driver in 65 nm CMOS.

Jeongho Hwang, Gyu-Seob Jeong, Woo-Rham Bae, Jun-Eun Park, Chang-Soo Yoon, Jungmin Yoon, Jiho Joo, Gyungock Kim, Deog-Kyoon Jeong

IEEE Trans. Circuits Syst. II Express Briefs, 2018

2015

A 22 to 26.5 Gb/s Optical Receiver With All-Digital Clock and Data Recovery in a 65 nm CMOS Process.

Sang-Hyeok Chu, Woo-Rham Bae, Gyu-Seob Jeong, Sungchun Jang, Sungwoo Kim, Jiho Joo, Gyungock Kim, Deog-Kyoon Jeong

IEEE J. Solid State Circuits, 2015

2014

A 26.5 Gb/s optical receiver with all-digital clock and data recovery in 65nm CMOS process.

Sang-Hyeok Chu, Woo-Rham Bae, Gyu-Seob Jeong, Jiho Joo, Gyungock Kim, Deog-Kyoon Jeong

Proceedings of the IEEE Asian Solid-State Circuits Conference, 2014