Yongping Lei

According to our database, Yongping Lei authored at least 2 papers between 2010 and 2018.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2018

Experimental analysis of Sn-3.0Ag-0.5Cu solder joint board-level drop/vibration impact failure models after thermal/isothermal cycling.

Jian Gu, Jian Lin, Yongping Lei, Hanguang Fu

Microelectron. Reliab., 2018

2010

Constitutive modeling on creep deformation for a SnPb-based composite solder reinforced with microsized Cu particles.

Yaowu Shi, Yanfu Yan, Jianping Liu, Zhidong Xia, Yongping Lei, Fu Guo, Xiaoyan Li

Microelectron. Reliab., 2010