According to our database1, Yongping Lei authored at least 2 papers between 2010 and 2018.
Legend:Book In proceedings Article PhD thesis Other
Experimental analysis of Sn-3.0Ag-0.5Cu solder joint board-level drop/vibration impact failure models after thermal/isothermal cycling.
Microelectronics Reliability, 2018
Constitutive modeling on creep deformation for a SnPb-based composite solder reinforced with microsized Cu particles.
Microelectronics Reliability, 2010