Yongping Lei

According to our database1, Yongping Lei authored at least 2 papers between 2010 and 2018.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Other 

Links

On csauthors.net:

Bibliography

2018
Experimental analysis of Sn-3.0Ag-0.5Cu solder joint board-level drop/vibration impact failure models after thermal/isothermal cycling.
Microelectronics Reliability, 2018

2010
Constitutive modeling on creep deformation for a SnPb-based composite solder reinforced with microsized Cu particles.
Microelectronics Reliability, 2010


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