Amar Mavinkurve

According to our database, Amar Mavinkurve authored at least 6 papers between 2014 and 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2025

Demystifying the Use of IC Plastic packages for Space Applications.

Md. Asaduz Zaman Mamun, Greta Terzariol, Luke Fortner, Amar Mavinkurve, Muhammad Ashraful Alam

Proceedings of the IEEE International Reliability Physics Symposium, 2025

2023

Transient Leakage Current as a Non-destructive Probe of Wire-bond Electrochemical Failures.

Md. Asaduz Zaman Mamun, Amar Mavinkurve, Michiel van Soestbergen, Muhammad Ashraful Alam

Proceedings of the IEEE International Reliability Physics Symposium, 2023

2016

Moisture absorption by molding compounds under extreme conditions: Impact on accelerated reliability tests.

Amar Mavinkurve, Jaume L. M. Llacer Martinez, Michiel van Soestbergen, Jeroen J. M. Zaal

Microelectron. Reliab., 2016

Predicting non-Fickian moisture diffusion in EMCs for application in micro-electronic devices.

Marco Barink, Amar Mavinkurve, J. Janssen

Microelectron. Reliab., 2016

2015

Moisture absorption and desorption in wafer level chip scale packages.

Kirsten Rongen, Amar Mavinkurve, M. Chen, P. J. van der Wel, F. Swartjes, Rene T. H. Rongen

Microelectron. Reliab., 2015

2014

Copper wire interconnect reliability evaluation using in-situ High Temperature Storage Life (HTSL) tests.

Amar Mavinkurve, Leon Goumans, G. M. O'Halloran, Rene T. H. Rongen, Mark-Luke Farrugia

Microelectron. Reliab., 2014