Chang-Chun Lee

According to our database, Chang-Chun Lee authored at least 7 papers between 2007 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2023

Demonstration on Warpage Estimation Approach Utilized in Fan-Out Panel-Level Packaging Enabled by Multi-Scale Process-Oriented Simulation.

Chi-Wei Wang, Che-Pei Chang, Chang-Chun Lee

Proceedings of the IEEE International Reliability Physics Symposium, 2023

2022

Neural Architecture Search for Inversion.

Cheng Zhan, Licheng Zhang, Xin Zhao, Chang-Chun Lee, Shujiao Huang

CoRR, 2022

2018

Effect of contact-etch-stop-layer and Si_1-xGe_x channel mechanical properties on nano-scaled short channel NMOSFETs with dummy gate arrays.

Chang-Chun Lee, Chuan-Hsi Liu, Dian-Yong Li, Chia-Ping Hsieh

Microelectron. Reliab., 2018

2015

Induced thermo-mechanical reliability of copper-filled TSV interposer by transient selective annealing technology.

Chang-Chun Lee, Chien-Chao Huang

Microelectron. Reliab., 2015

Electrical characteristics and reliability performance of IGBT power device packaging by chip embedding technology.

Tao-Chih Chang, Chang-Chun Lee, Chia-Ping Hsieh, Sheng-Che Hung, Ren-Shin Cheng

Microelectron. Reliab., 2015

2012

Light degradation test and design of thermal performance for high-power light-emitting diodes.

Yen-Fu Su, Shin-Yueh Yang, Tuan-Yu Hung, Chang-Chun Lee, Kuo-Ning Chiang

Microelectron. Reliab., 2012

2007

Solder joints layout design and reliability enhancements of wafer level packaging using response surface methodology.

Chang-Chun Lee, Chien-Chen Lee, Hsiao-Tung Ku, Shu-Ming Chang, Kuo-Ning Chiang

Microelectron. Reliab., 2007