M. H. Lin

According to our database, M. H. Lin authored at least 7 papers between 2005 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2023

A Novel Methodology to Predict Process-Induced Warpage in Advanced BEOL Interconnects.

Y. H. Lin, C. C. Lee, C. Y. Liao, M. H. Lin, W. C. Tu, Robin Chen, H. P. Chen, Winston S. Shue, Min Cao

Proceedings of the IEEE International Reliability Physics Symposium, 2023

2022

Redundancy Effect on Electromigration Failure Time in Power Grid Networks.

M. H. Lin, C. I. Lin, Y. C. Wang, Aaron Wang

Proceedings of the IEEE International Reliability Physics Symposium, 2022

2015

Mechanisms of electromigration under AC and pulsed-DC stress in Cu/low-k dual damascene interconnects.

M. H. Lin, A. S. Oates

Proceedings of the IEEE International Reliability Physics Symposium, 2015

2008

Effects of length scaling on electromigration in dual-damascene copper interconnects.

M. H. Lin, M. T. Lin, Tahui Wang

Microelectron. Reliab., 2008

2007

Effects of width scaling and layout variation on dual damascene copper interconnect electromigration.

M. H. Lin, K. P. Chang, K. C. Su, Tahui Wang

Microelectron. Reliab., 2007

2005

Copper interconnect electromigration behaviors in various structures and lifetime improvement by cap/dielectric interface treatment.

M. H. Lin, Y. L. Lin, K. P. Chang, K. C. Su, Tahui Wang

Microelectron. Reliab., 2005

A location-based incentive pricing scheme for tree-based relaying in multi-hop cellular networks.

M. H. Lin, C. C. Lo

Proceedings of the Integrated Network Management, 2005