Ping-Feng Yang

According to our database, Ping-Feng Yang authored at least 7 papers between 2006 and 2015.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2015

Thermal resistance of side by side multi-chip package: Thermal mode analysis.

Dao-Long Chen, Tei-Chen Chen, Ping-Feng Yang, Yi-Shao Lai

Microelectron. Reliab., 2015

2014

Nanotribological properties of ALD-processed bilayer TiO₂/ZnO films.

Wun-Kai Wang, Hua-Chiang Wen, Chun-Hu Cheng, Ching-Hua Hung, Wu-Ching Chou, Wei-Hung Yau, Ping-Feng Yang, Yi-Shao Lai

Microelectron. Reliab., 2014

2012

A review of three-dimensional viscoelastic models with an application to viscoelasticity characterization using nanoindentation.

Dao-Long Chen, Ping-Feng Yang, Yi-Shao Lai

Microelectron. Reliab., 2012

2011

Evaluating nanotribological behavior of annealing Si_0.8Ge_0.2/Si films.

Ming-Jhang Wu, Hua-Chiang Wen, Shyh-Chi Wu, Ping-Feng Yang, Yi-Shao Lai, Wen-Kuang Hsu, Wen-Fa Wu, Chang-Pin Chou

Microelectron. Reliab., 2011

2010

Evaluation of the nanoindentation behaviors of SiGe epitaxial layer on Si substrate.

Bo-Ching He, Chun-Hu Cheng, Hua-Chiang Wen, Yi-Shao Lai, Ping-Feng Yang, Meng-Hung Lin, Wen-Fa Wu, Chang-Pin Chou

Microelectron. Reliab., 2010

2008

Characteristics of ZnO thin films prepared by radio frequency magnetron sputtering.

Ping-Feng Yang, Hua-Chiang Wen, Sheng-Rui Jian, Yi-Shao Lai, Sean Wu, Rong-Sheng Chen

Microelectron. Reliab., 2008

2006

Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition.

Yi-Shao Lai, Ping-Feng Yang, Chang-Lin Yeh

Microelectron. Reliab., 2006