Chi-Wa U

Orcid: 0000-0001-5338-2637

According to our database1, Chi-Wa U authored at least 12 papers between 2017 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Bibliography

2024
Sub-μW Auto-Calibration Bandgap Voltage Reference With 1σ Inaccuracy of ± 0.12% Within - 40°C to 120°C.
IEEE J. Solid State Circuits, February, 2024

2023
An 1 V Supply, 740 nW, 8.7 ppm/°C Bandgap Voltage Reference With Segmented Curvature Compensation.
IEEE Trans. Circuits Syst. I Regul. Pap., December, 2023

A 0.5V 22.5ppm/°C Bandgap Voltage Reference With Leakage Current Injection for Curvature Correction.
IEEE Trans. Circuits Syst. II Express Briefs, October, 2023

2022
Switched-Capacitor Bandgap Voltage Reference for IoT Applications.
IEEE Trans. Circuits Syst. I Regul. Pap., 2022

2021
Auto-Calibration Technique for Current-Based Bandgap Voltage Reference.
Proceedings of the IEEE Asian Solid-State Circuits Conference, 2021

2020
A SAR-ADC-Assisted DC-DC Buck Converter With Fast Transient Recovery.
IEEE Trans. Circuits Syst. II Express Briefs, 2020

A 0.5-V Supply, 36 nW Bandgap Reference With 42 ppm/°C Average Temperature Coefficient Within -40 °C to 120 °C.
IEEE Trans. Circuits Syst., 2020

A -40 ​°C-125 ​°C, 1.08 ​ppm/°C, 918 ​nW bandgap voltage reference with segmented curvature compensation.
Microelectron. J., 2020

Analysis, Design and Control of an Integrated Three-Level Buck Converter under DCM Operation.
J. Circuits Syst. Comput., 2020

2019
Review and Comparison of Integrated Inductive-Based Hybrid Step-Up DC-DC Converter under CCM.
Proceedings of the 62nd IEEE International Midwest Symposium on Circuits and Systems, 2019

Review and Comparison of Integrated Inductive-Based Hybrid Step-Down DC-DC Converter Under CCM Operation.
Proceedings of the 2019 IEEE Asia Pacific Conference on Circuits and Systems, 2019

2017
CCM operation analysis and parameters design of Negative Output Elementary Luo Converter for ripple suppression.
Proceedings of the IECON 2017 - 43rd Annual Conference of the IEEE Industrial Electronics Society, Beijing, China, October 29, 2017


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