Chiu-Wen Lee

According to our database, Chiu-Wen Lee authored at least 1 paper in 2007.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2007

Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy.

Yi-Shao Lai, Kuo-Ming Chen, Chin-Li Kao, Chiu-Wen Lee, Ying-Ta Chiu

Microelectron. Reliab., 2007