Ying-Ta Chiu

According to our database, Ying-Ta Chiu authored at least 4 papers between 2007 and 2014.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2014

Investigation of electromigration reliability of redistribution lines in wafer-level chip-scale packages.

Chin-Li Kao, Tei-Chen Chen, Yi-Shao Lai, Ying-Ta Chiu

Microelectron. Reliab., 2014

2012

Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints.

Jenn-Ming Song, Yao-Ren Liu, Yi-Shao Lai, Ying-Ta Chiu, Ning-Cheng Lee

Microelectron. Reliab., 2012

2009

Alloying modification of Sn-Ag-Cu solders by manganese and titanium.

Li-Wei Lin, Jenn-Ming Song, Yi-Shao Lai, Ying-Ta Chiu, Ning-Cheng Lee, Jun-Yen Uan

Microelectron. Reliab., 2009

2007

Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy.

Yi-Shao Lai, Kuo-Ming Chen, Chin-Li Kao, Chiu-Wen Lee, Ying-Ta Chiu

Microelectron. Reliab., 2007