Deepak Kachave

Orcid: 0000-0003-3181-4835

According to our database1, Deepak Kachave authored at least 11 papers between 2016 and 2019.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Links

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Bibliography

2019
Low Cost Functional Obfuscation of Reusable IP Ores Used in CE Hardware Through Robust Locking.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2019

2018
Spatial and Temporal Redundancy for Transient Fault-Tolerant Datapath.
IEEE Trans. Aerosp. Electron. Syst., 2018

Effect of NBTI stress on DSP cores used in CE devices: threat model and performance estimation.
IET Comput. Digit. Tech., 2018

Forensic engineering for resolving ownership problem of reusable IP core generated during high level synthesis.
Future Gener. Comput. Syst., 2018

Shielding CE Hardware Against Reverse-Engineering Attacks Through Functional Locking [Hardware Matters].
IEEE Consumer Electron. Mag., 2018

Integrating Compiler Driven Transformation and Simulated Annealing Based Floorplan for Optimized Transient Fault Tolerant DSP Cores.
Proceedings of the IEEE International Symposium on Smart Electronic Systems, 2018

2017
Low cost fault tolerance against k<sub>c</sub>-cycle and k<sub>m</sub>-unit transient for loop based control data flow graphs during physically aware high level synthesis.
Microelectron. Reliab., 2017

Reliability and Threat Analysis of NBTI Stress on DSP Cores.
Proceedings of the IEEE International Symposium on Nanoelectronic and Information Systems, 2017

2016
Integrating physical level design and high level synthesis for simultaneous multi-cycle transient and multiple transient fault resiliency of application specific datapath processors.
Microelectron. Reliab., 2016

Generating Multi-cycle and Multiple Transient Fault Resilient Design During Physically Aware High Level Synthesis.
Proceedings of the IEEE Computer Society Annual Symposium on VLSI, 2016

Protecting Ownership of Reusable IP Core Generated during High Level Synthesis.
Proceedings of the IEEE International Symposium on Nanoelectronic and Information Systems, 2016


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