Fa Xing Che

According to our database, Fa Xing Che authored at least 4 papers between 2011 and 2016.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2016

Reliability study of 3D IC packaging based on through-silicon interposer (TSI) and silicon-less interconnection technology (SLIT) using finite element analysis.

Fa Xing Che, Xiaowu Zhang, Jong-Kai Lin

Microelectron. Reliab., 2016

2012

Novel Fe-containing Sn-1Ag-0.5Cu lead-free solder alloy with further enhanced elastic compliance and plastic energy dissipation ability for mobile products.

Dhafer Abdulameer Shnawah, Suhana Binti Mohd Said, Mohd Faizul Mohd Sabri, Irfan Anjum Badruddin, Fa Xing Che

Microelectron. Reliab., 2012

2011

Experiment and numerical analysis for edge and corner bonded PoP bottom package assemblies under four-point bending.

Hongbin Shi, Fa Xing Che, Toshitsugu Ueda

Microelectron. Reliab., 2011

Numerical and experimental study on Cu protrusion of Cu-filled through-silicon vias (TSV).

Fa Xing Che, Wahyuaji Narottama Putra, A. Heryanto, A. Trigg, S. Gao, Chee Lip Gan

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011