Doo Kim

According to our database, Doo Kim authored at least 1 paper in 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

Handling Die-to-Die I/O Pads for 3DIC Interconnect Tests.

Sandeep Kumar Goel, Moiz Khan, Ankita Patidar, Frank Lee, Vuong Nguyen, Bharath Shankaranarayanan, Doo Kim, Manish Arora

Proceedings of the IEEE International Test Conference, 2024