Moiz Khan

According to our database, Moiz Khan authored at least 4 papers between 2023 and 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2025

Descriptive Language For 3D IC Die-to-Die Interconnect Repair For IEEE P3405 Standard.

Ashish Reddy Bommana, Anshuman Chandra, Moiz Khan

Proceedings of the IEEE International Test Conference in Asia, 2025

2024

Physical-Aware Interconnect Test for Multi-Die Systems Using 3Dblox Open Standard.

Sandeep Kumar Goel, Ankita Patidar, Moiz Khan, Frank Lee, Anshuman Chandra, Martin Keim, Naim Lemar, Jonathan Gaudet, Quoc Phan, Vidya Neerkundar

Proceedings of the IEEE International Test Conference, 2024

Handling Die-to-Die I/O Pads for 3DIC Interconnect Tests.

Sandeep Kumar Goel, Moiz Khan, Ankita Patidar, Frank Lee, Vuong Nguyen, Bharath Shankaranarayanan, Doo Kim, Manish Arora

Proceedings of the IEEE International Test Conference, 2024

2023

A Case Study on IEEE 1838 Compliant Multi-Die 3DIC DFT Implementation.

Anshuman Chandra, Moiz Khan, Ankita Patidar, Fumiaki Takashima, Sandeep Kumar Goel, Bharath Shankaranarayanan, Vuong Nguyen, Vistrita Tyagi, Manish Arora

Proceedings of the IEEE International Test Conference, 2023