Fei Chong Ng

According to our database, Fei Chong Ng authored at least 3 papers between 2016 and 2018.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of six.

2018

Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches.

Fei Chong Ng, Aizat Abas, Mohd Zulkifly Abdullah

Microelectron. Reliab., 2018

2017

Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings.

Fei Chong Ng, Aizat Abas, Z. L. Gan, Mohd Zulkifly Abdullah, F. Che Ani, M. Yusuf Tura Ali

Microelectron. Reliab., 2017

2016

Effect of thermocapillary action in the underfill encapsulation of multi-stack ball grid array.

Fei Chong Ng, Aizat Abas, Muhammad Hafifi Hafiz Ishak, Mohd Zulkifly Abdullah, M. S. Abdul Aziz

Microelectron. Reliab., 2016