Mohd Zulkifly Abdullah

According to our database, Mohd Zulkifly Abdullah authored at least 28 papers between 2010 and 2021.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2021

Design and Fabrication of a Dual Rotor-Embedded Wing Vertical Take-Off and Landing Unmanned Aerial Vehicle.

Seng Man Wong, Hann Woei Ho, Mohd Zulkifly Abdullah

Unmanned Syst., 2021

Double-Layer Micro Porous Media Burner from Lean to Rich Fuel Mixture: Analysis of Entropy Generation and Exergy Efficiency.

Nazmi Che Ismail, Mohd Zulkifly Abdullah, Khairil Faizi Mustafa, Nurul Musfirah Mazlan, Prem Gunnasegaran, Agustinus Purna Irawan

Entropy, 2021

2020

Entropy Generation and Exergy Analysis of Premixed Fuel-Air Combustion in Micro Porous Media Burner.

Nazmi Che Ismail, Mohd Zulkifly Abdullah, Nurul Musfirah Mazlan, Khairil Faizi Mustafa

Entropy, 2020

2018

Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches.

Fei Chong Ng, Aizat Abas, Mohd Zulkifly Abdullah

Microelectron. Reliab., 2018

Investigation on nano-reinforced solder paste after reflow soldering part 1: Effects of nano-reinforced solder paste on melting, hardness, spreading rate, and wetting quality.

Srivalli Chellvarajoo, Mohd Zulkifly Abdullah

Microelectron. Reliab., 2018

2017

Heat transfer enhancement of LEDs with a combination of piezoelectric fans and a heat sink.

Shaker Farid Sufian, Mohd Zulkifly Abdullah

Microelectron. Reliab., 2017

Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings.

Fei Chong Ng, Aizat Abas, Z. L. Gan, Mohd Zulkifly Abdullah, F. Che Ani, M. Yusuf Tura Ali

Microelectron. Reliab., 2017

Numerical simulation of self-alignment of chip resistor components for different silver content during reflow soldering.

A. M. Najib, Mohd Zulkifly Abdullah, Abdullah Aziz Saad, Z. Samsudin, F. Che Ani

Microelectron. Reliab., 2017

Experimental and numerical investigation of flow and thermal effects on flexible printed circuit board.

Chong Hooi Lim, Mohd Zulkifly Abdullah, Ishak Abdul Azid, M. S. Abdul Aziz

Microelectron. Reliab., 2017

Discrete phase method particle simulation of ultra-fine package assembly with SAC305-TiO₂ nano-reinforced lead free solder at different weighted percentages.

M. S. Haslinda, Aizat Abas, F. Che Ani, A. Jalar, Abdullah Aziz Saad, Mohd Zulkifly Abdullah

Microelectron. Reliab., 2017

2016

Effect of thermocapillary action in the underfill encapsulation of multi-stack ball grid array.

Fei Chong Ng, Aizat Abas, Muhammad Hafifi Hafiz Ishak, Mohd Zulkifly Abdullah, M. S. Abdul Aziz

Microelectron. Reliab., 2016

Lattice Boltzmann method study of effect three dimensional stacking-chip package layout on micro-void formation during encapsulation process.

Muhammad Hafifi Hafiz Ishak, Mohd Zulkifly Abdullah, Aizat Abas

Microelectron. Reliab., 2016

Lattice Boltzmann method study of bga bump arrangements on void formation.

Aizat Abas, Muhammad Hafifi Hafiz Ishak, Mohd Zulkifly Abdullah, F. Che Ani, Soon Fuat Khor

Microelectron. Reliab., 2016

Lattice Boltzmann Model of 3D Multiphase Flow in Artery Bifurcation Aneurysm Problem.

Aizat Abas, Noorhafizah Hafizah Mokhtar, Muhammad Hafifi Hafiz Ishak, Mohd Zulkifly Abdullah, Ang H. O. Tian

Comput. Math. Methods Medicine, 2016

2015

Optimization of pin through hole connector in thermal fluid-structure interaction analysis of wave soldering process using response surface methodology.

M. S. Abdul Aziz, Mohd Zulkifly Abdullah, C. Y. Khor, I. A. Azid

Simul. Model. Pract. Theory, 2015

2014

Thermal analysis of dual piezoelectric fans for cooling multi-LED packages.

Shaker Farid Sufian, Z. M. Fairuz, Mohammed Zubair, Mohd Zulkifly Abdullah, Julie Juliewatty Mohamed

Microelectron. Reliab., 2014

Influence of solder bump arrangements on molded IC encapsulation.

C. Y. Khor, Mohd Zulkifly Abdullah, Chun-Sean Lau, W. C. Leong, M. S. Abdul Aziz

Microelectron. Reliab., 2014

Recent fluid-structure interaction modeling challenges in IC encapsulation - A review.

C. Y. Khor, Mohd Zulkifly Abdullah, Chun-Sean Lau, I. A. Azid

Microelectron. Reliab., 2014

2013

FSI implications of EMC rheological properties to 3D IC with TSV structures during plastic encapsulation process.

Ernest E. S. Ong, Mohd Zulkifly Abdullah, W. K. Loh, C. K. Ooi, R. Chan

Microelectron. Reliab., 2013

Optimization of flexible printed circuit board electronics in the flow environment using response surface methodology.

W. C. Leong, Mohd Zulkifly Abdullah, C. Y. Khor

Microelectron. Reliab., 2013

Analysis of fluid/structure interaction: Influence of silicon chip thickness in moulded packaging.

C. Y. Khor, Mohd Zulkifly Abdullah

Microelectron. Reliab., 2013

2012

Optimization of IC encapsulation considering fluid/structure interaction using response surface methodology.

C. Y. Khor, Mohd Zulkifly Abdullah

Simul. Model. Pract. Theory, 2012

Application of flexible printed circuit board (FPCB) in personal computer motherboards: Focusing on mechanical performance.

W. C. Leong, Mohd Zulkifly Abdullah, C. Y. Khor

Microelectron. Reliab., 2012

Optimization modeling of the cooling stage of reflow soldering process for ball grid array package using the gray-based Taguchi method.

Chun-Sean Lau, Mohd Zulkifly Abdullah, F. Che Ani

Microelectron. Reliab., 2012

Investigation of the fluid/structure interaction phenomenon in IC packaging.

C. Y. Khor, Mohd Zulkifly Abdullah, H. J. Tony Tan, W. C. Leong, D. Ramdan

Microelectron. Reliab., 2012

Design of DNA biosensors and amperometric microchips featuring copper electrodes.

Motasem H. Ghanim, Kamariah Hasan, Nazalan Najimudin, Mohd Zulkifly Abdullah

Proceedings of 2012 IEEE-EMBS International Conference on Biomedical and Health Informatics, 2012

2010

Finite volume based CFD simulation of pressurized flip-chip underfill encapsulation process.

C. Y. Khor, M. Abdul Mujeebu, Mohd Zulkifly Abdullah, F. Che Ani

Microelectron. Reliab., 2010

Design of an underwater glider platform for shallow-water applications.

Nur Afande Ali Hussain, Ting Ming Chung, Mohd Rizal Arshad, Rosmiwati Mohd-Mokhtar, Mohd Zulkifly Abdullah

Int. J. Intell. Def. Support Syst., 2010