F. Che Ani

According to our database, F. Che Ani authored at least 6 papers between 2010 and 2017.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of six.

2017

Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings.

Fei Chong Ng, Aizat Abas, Z. L. Gan, Mohd Zulkifly Abdullah, F. Che Ani, M. Yusuf Tura Ali

Microelectron. Reliab., 2017

Numerical simulation of self-alignment of chip resistor components for different silver content during reflow soldering.

A. M. Najib, Mohd Zulkifly Abdullah, Abdullah Aziz Saad, Z. Samsudin, F. Che Ani

Microelectron. Reliab., 2017

Discrete phase method particle simulation of ultra-fine package assembly with SAC305-TiO₂ nano-reinforced lead free solder at different weighted percentages.

M. S. Haslinda, Aizat Abas, F. Che Ani, A. Jalar, Abdullah Aziz Saad, Mohd Zulkifly Abdullah

Microelectron. Reliab., 2017

2016

Lattice Boltzmann method study of bga bump arrangements on void formation.

Aizat Abas, Muhammad Hafifi Hafiz Ishak, Mohd Zulkifly Abdullah, F. Che Ani, Soon Fuat Khor

Microelectron. Reliab., 2016

2012

Optimization modeling of the cooling stage of reflow soldering process for ball grid array package using the gray-based Taguchi method.

Chun-Sean Lau, Mohd Zulkifly Abdullah, F. Che Ani

Microelectron. Reliab., 2012

2010

Finite volume based CFD simulation of pressurized flip-chip underfill encapsulation process.

C. Y. Khor, M. Abdul Mujeebu, Mohd Zulkifly Abdullah, F. Che Ani

Microelectron. Reliab., 2010