Shunsuke Nemoto

According to our database, Shunsuke Nemoto authored at least 5 papers between 2006 and 2017.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2017

Thermal impact of extreme die thinning in bump-bonded three-dimensional integrated circuits.

Samson Melamed, Naoya Watanabe, Shunsuke Nemoto, Haruo Shimamoto, Katsuya Kikuchi, Masahiro Aoyagi

Microelectron. Reliab., 2017

2016

Impact of thinning stacked dies on the thermal resistance of bump-bonded three-dimensional integrated circuits.

Samson Melamed, Naoya Watanabe, Shunsuke Nemoto, Haruo Shimamoto, Katsuya Kikuchi, Masahiro Aoyagi

Microelectron. Reliab., 2016

2013

Investigation of optimized high-density flip-chip interconnect design including micro Au bumps for 3-D stacked LSI packaging.

Katsuya Kikuchi, Fumiki Kato, Shunsuke Nemoto, Hiroshi Nakagawa, Masahiro Aoyagi, Youtaro Yasu, Kohji Koshiji

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

New optical three dimensional structure measurement method of cone shape micro bumps used for 3D LSI chip stacking.

Masahiro Aoyagi, Naoya Watanabe, Motohiro Suzuki, Katsuya Kikuchi, Shunsuke Nemoto, Noriaki Arima, Misaki Ishizuka, Koji Suzuki, Toshio Shiomi

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2006

Phase control for resonant DC-DC converter with class-DE inverter and class-E rectifier.

Hiroo Sekiya, Shunsuke Nemoto, Jianming Lu, Takashi Yahagi

IEEE Trans. Circuits Syst. I Regul. Pap., 2006