Gabriel Pares

According to our database, Gabriel Pares authored at least 4 papers between 2018 and 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2025

Ultra-Thin-Body and Buried Oxide FD-SOI next generation nodes and eNVM technologies for advanced IC design.

Claire Fenouillet-Béranger, Laurent Fesquet, Rihab Chouk, Gabriel Pares, Baudoin Martineau, Marie Claire Cyrille, Thierry Poiroux, Olivier Billoint, Dominique Noguet

Proceedings of the 28th IEEE International Symposium on Design and Diagnostics of Electronic Circuits and Systems, 2025

2023

Demonstration of SMT-reflow Immune and SCA-resilient PUF on 28nm RRAM device array.

Vivek Parmar, Sandeep Kaur Kingra, Deepak Verma, Digamber Pandey, Giuseppe Piccolboni, Alessandro Bricalli, Amir Regev, Gabriel Pares, Laurent Grenouillet, Jean-François Nodin, Manan Suri

Proceedings of the IEEE International Memory Workshop, 2023

2018

Integrated, Scalable and Reconfigurable Silicon Photonics Based Optical Switch for Colorless, Directionless and Contentionless Operation.

Stefano Tondini, Astghik Chalyan, Giorgio Fontana, Lorenzo Pavesi, Nikola Zecevic, Michael Hofbauer, Bernhard Goll, Horst Zimmermann, Stefano Stracca, Alberto Bianchi, Costanza Manganelli, Philippe Velha, Paolo Pintus, Fabrizio Di Pasquale, Claudio J. Oton, Christophe Kopp, Laetitia Adelmini, Olivier Lemonnier, Gabriel Pares, Guido Chiaretti, Aina Serrano, Jose Angel Ayucar, Giovani Battista Preve, Minsu Kim, Jong Moo Lee, Francesco Testa

Proceedings of the Optical Fiber Communications Conference and Exposition, 2018

A 10Gb/s Si-photonic transceiver with 150μW 120μs-lock-time digitally supervised analog microring wavelength stabilization for 1Tb/s/mm² Die-to-Die Optical Networks.

Yvain Thonnart, Mounir Zid, Jose-Luis Gonzalez Jimenez, Guillaume Waltener, Robert Polster, Olivier Dubray, Florent Lepin, Stéphane Bernabé, Sylvie Menezo, Gabriel Pares, Olivier Castany, Laura Boutafa, Philippe Grosse, Benoît Charbonnier, Charles Baudot

Proceedings of the 2018 IEEE International Solid-State Circuits Conference, 2018