Ganesh Subbarayan

Orcid: 0000-0003-0462-1130

According to our database1, Ganesh Subbarayan authored at least 16 papers between 2002 and 2022.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Awards

IEEE Fellow

IEEE Fellow 2011, "For contributions to reliability and their associated computational techniques in mechanics".

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
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Links

On csauthors.net:

Bibliography

2022
Efficient Local Refinement near Parametric Boundaries Using kd-Tree Data Structure and Algebraic Level Sets.
Algorithms, 2022

2021
Improved Dixon Resultant for Generating Signed Algebraic Level Sets and Algebraic Boolean Operations on Closed Parametric Surfaces.
Comput. Aided Des., 2021

2020
Algebraic Point Projection for Immersed Boundary Analysis on Low Degree NURBS Curves and Surfaces.
Algorithms, 2020

Reliability of Metal-Dielectric Structures Under Intermittent Current Pulsing.
Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

2019
Maximum Entropy Models for Fatigue Damage in Metals with Application to Low-Cycle Fatigue of Aluminum 2024-T351.
Entropy, 2019

2017
Signed algebraic level sets on NURBS surfaces and implicit Boolean compositions for isogeometric CAD-CAE integration.
Comput. Aided Des., 2017

2015
HiGeoM: A symbolic framework for a unified function space representation of trivariate solids for isogeometric analysis.
Comput. Aided Des., 2015

2014
Maximum entropy fracture model and its use for predicting cyclic hysteresis in Sn3.8Ag0.7Cu and Sn3.0Ag0.5 solder alloys.
Microelectron. Reliab., 2014

A TSV-cross-link-based approach to 3D-clock network synthesis for improved robustness.
Proceedings of the Great Lakes Symposium on VLSI 2014, GLSVLSI '14, Houston, TX, USA - May 21, 2014

2013
Analytical estimates of stress around a doubly periodic arrangement of through-silicon vias.
Microelectron. Reliab., 2013

Effect of pad surface finish and reflow cooling rate on the microstructure and the mechanical behavior of SnAgCu solder alloys.
Microelectron. Reliab., 2013

2009
Thermally induced wrinkling in thin-film stacks on patterned substrates.
IBM J. Res. Dev., 2009

2006
jNURBS: An object-oriented, symbolic framework for integrated, meshless analysis and optimal design.
Adv. Eng. Softw., 2006

2004
Constructive solid analysis: a hierarchical, geometry-based meshless analysis procedure for integrated design and analysis.
Comput. Aided Des., 2004

Maintaining an Accurate Printer Characterization.
Proceedings of the Twelfth Color Imaging Conference: Color Science and Engineering Systems, 2004

2002
Pareto-optimal formulations for cost versus colorimetric accuracy trade-offs in printer color management.
ACM Trans. Graph., 2002


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