Hankyul Kwon

According to our database, Hankyul Kwon authored at least 6 papers between 2022 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

20.7 NeuGPU: A 18.5mJ/Iter Neural-Graphics Processing Unit for Instant-Modeling and Real-Time Rendering with Segmented-Hashing Architecture.

Junha Ryu, Hankyul Kwon, Wonhoon Park, Zhiyong Li, Beomseok Kwon, Donghyeon Han, Dongseok Im, Sangyeob Kim, Hyungnam Joo, Hoi-Jun Yoo

Proceedings of the IEEE International Solid-State Circuits Conference, 2024

2023

A Mobile 3-D Object Recognition Processor With Deep-Learning-Based Monocular Depth Estimation.

Dongseok Im, Gwangtae Park, Zhiyong Li, Junha Ryu, Sanghoon Kang, Donghyeon Han, Jinsu Lee, Wonhoon Park, Hankyul Kwon, Hoi-Jun Yoo

IEEE Micro, 2023

DSPU: An Efficient Deep Learning-Based Dense RGB-D Data Acquisition With Sensor Fusion and 3-D Perception SoC.

Dongseok Im, Gwangtae Park, Junha Ryu, Zhiyong Li, Sanghoon Kang, Donghyeon Han, Jinsu Lee, Wonhoon Park, Hankyul Kwon, Hoi-Jun Yoo

IEEE J. Solid State Circuits, 2023

A 15.9 mW 96.5 fps Memory-Efficient 3D Reconstruction Processor with Dilation-based TSDF Fusion and Block-Projection Cache System.

Hankyul Kwon, Gwangtae Park, Junha Ryu, Wooyoung Jo, Hoi-Jun Yoo

Proceedings of the IEEE International Symposium on Circuits and Systems, 2023

2022

DSPU: A 281.6mW Real-Time Deep Learning-Based Dense RGB-D Data Acquisition with Sensor Fusion and 3D Perception System-on-Chip.

Dongseok Im, Gwangtae Park, Zhiyong Li, Junha Ryu, Sanghoon Kang, Donghyeon Han, Jinsu Lee, Wonhoon Park, Hankyul Kwon, Hoi-Jun Yoo

Proceedings of the 2022 IEEE Hot Chips 34 Symposium, 2022

A Low-power and Real-time 3D Object Recognition Processor with Dense RGB-D Data Acquisition in Mobile Platforms.

Dongseok Im, Gwangtae Park, Junha Ryu, Zhiyong Li, Sanghoon Kang, Donghyeon Han, Jinsu Lee, Wonhoon Park, Hankyul Kwon, Hoi-Jun Yoo

Proceedings of the IEEE Symposium in Low-Power and High-Speed Chips, 2022