Helmut Köck

Orcid: 0000-0003-2183-5288

According to our database1, Helmut Köck authored at least 5 papers between 2007 and 2012.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

Legend:

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PhD thesis 
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Links

Online presence:

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Bibliography

2012
Modeling of highly anisotropic microstructures for electro-thermal simulations of power semiconductor devices.
Microelectron. Reliab., 2012

2011
Improved thermal management of low voltage power devices with optimized bond wire positions.
Microelectron. Reliab., 2011

ANSYS based 3D electro-thermal simulations for the evaluation of power MOSFETs robustness.
Microelectron. Reliab., 2011

2009
IR thermography and FEM simulation analysis of on-chip temperature during thermal-cycling power-metal reliability testing using in situ heated structures.
Microelectron. Reliab., 2009

2007
Flexible active cycle stress testing of smart power switches.
Microelectron. Reliab., 2007


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