Michael Glavanovics

According to our database1, Michael Glavanovics authored at least 12 papers between 2004 and 2023.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

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Bibliography

2023
A common hard-failure mechanism in GaN HEMTs in accelerated switching and single-pulse short-circuit tests.
Proceedings of the IEEE International Reliability Physics Symposium, 2023

2015
Executable test definition for a state machine driven embedded test controller module.
Proceedings of the 13th IEEE International Conference on Industrial Informatics, 2015

2013
Distributed power semiconductor stress test & measurement architecture.
Proceedings of the 11th IEEE International Conference on Industrial Informatics, 2013

2012
Modeling of highly anisotropic microstructures for electro-thermal simulations of power semiconductor devices.
Microelectron. Reliab., 2012

2011
A reliable technology concept for active power cycling to extreme temperatures.
Microelectron. Reliab., 2011

Improved thermal management of low voltage power devices with optimized bond wire positions.
Microelectron. Reliab., 2011

Applying Bayesian mixtures-of-experts models to statistical description of smart power semiconductor reliability.
Microelectron. Reliab., 2011

2010
Non-linear thermal modeling of DMOS transistor and validation using electrical measurements and FEM simulations.
Microelectron. J., 2010

2009
IR thermography and FEM simulation analysis of on-chip temperature during thermal-cycling power-metal reliability testing using in situ heated structures.
Microelectron. Reliab., 2009

System level modeling of smart power switches using SystemC-AMS for digital protection concept verification.
Proceedings of the 2009 IEEE International Behavioral Modeling and Simulation Workshop, 2009

2007
Flexible active cycle stress testing of smart power switches.
Microelectron. Reliab., 2007

2004
Analysis of wire bond and metallization degradation mechanisms in DMOS power transistors stressed under thermal overload conditions.
Microelectron. Reliab., 2004


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