Hengchang Bi

According to our database, Hengchang Bi authored at least 7 papers between 2013 and 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2025

Human-centred design and fabrication of a wearable multimodal visual assistance system.

Jian Tang, Yi Zhu, Gai Jiang, Lin Xiao, Wei Ren, Yu Zhou, Qinying Gu, Biao Yan, Jiayi Zhang, Hengchang Bi, Xing Wu, Zhiyong Fan, Leilei Gu

Nat. Mac. Intell., 2025

A 0.473 μJ/class Seizure Detection Processor with LSVM Classifier and LPF-Based Feature Extraction.

Wenxian Gu, Xudong Hao, Hengchang Bi, Xing Wu, C.-J. Richard Shi, Liangjian Lyu

Proceedings of the IEEE International Symposium on Circuits and Systems, 2025

2023

A Spike-Sorting-Assisted Compressed Sensing Processor for High-Density Neural Interfaces.

Qingzhen Wang, Wenxian Gu, Hengchang Bi, Liangjian Lyu, Deli Qiao, Xing Wu

Proceedings of the 15th IEEE International Conference on ASIC, 2023

2022

Flexible Pressure Sensor Array with Multi-Channel Wireless Readout Chip.

Haohan Wangxu, Liangjian Lyu, Hengchang Bi, Xing Wu

Sensors, 2022

2021

Analog Sensing and Computing Systems with Low Power Consumption for Gesture Recognition.

Tianyi Fan, Zheyu Liu, Zewei Luo, Junda Li, Xiyue Tian, Yeshen Chen, Yuan Feng, Chaolun Wang, Hengchang Bi, Xinming Li, Fei Qiao, Xing Wu

Adv. Intell. Syst., 2021

2013

Fabrication of graphene based electrothermal cantilever actuator.

Yilong Zhou, Hengchang Bi, Xiao Xie, Litao Sun

Proceedings of the 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2013

Low temperature casting of graphene into various 3-D shapes.

Shu Wan, Hengchang Bi, Kuibo Yin, Xiao Xie, Yilong Zhou, Neng Wan, Feng Xu, Litao Sun

Proceedings of the 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2013