Xing Wu
Orcid: 0000-0002-9207-6744Affiliations:
- East China Normal University, School of Communication and Electronic Engineering, Department of Electrical Engineering, Shanghai, China
According to our database1,
Xing Wu authored at least 20 papers
between 2015 and 2026.
Collaborative distances:
Collaborative distances:
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Bibliography
2026
A 1ppm/°C and ±0.066% 3σ Accuracy Bandgap Reference with Temperature-Adaptive PTAT Scaling.
Proceedings of the IEEE International Solid-State Circuits Conference, 2026
A 256-Channel, 3.49-mW Wireless Neural Recording SoC with Adaptive Delta Compression and Error-Resilient Coding.
Proceedings of the IEEE Custom Integrated Circuits Conference, 2026
2025
An Integer-N Reference-Double-Sampling PLL for Frequency-Multiplied Octa-Phase Clock Generation Achieving -251.9 dB FOM<sub>Jitter-N</sub>.
IEEE Trans. Circuits Syst. I Regul. Pap., December, 2025
A 225-μW Interference-Tolerant Receiver With Shared Wireless LO and Envelope-Tracking Mixer Achieving -104-dBm Sensitivity.
IEEE J. Solid State Circuits, March, 2025
A 0.473 μJ/class Seizure Detection Processor with LSVM Classifier and LPF-Based Feature Extraction.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2025
2023
The Human Activity Radar Challenge: Benchmarking Based on the 'Radar Signatures of Human Activities' Dataset From Glasgow University.
IEEE J. Biomed. Health Informatics, April, 2023
Catching the Missing EM Consequence in Soft Breakdown Reliability in Advanced FinFETs: Impacts of Self-heating, On-State TDDB, and Layout Dependence.
Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023
Microscopic Characterization of Failure Mechanisms in Long-Term Implanted Microwire Neural Electrodes.
Proceedings of the IEEE International Reliability Physics Symposium, 2023
A Spike-Sorting-Assisted Compressed Sensing Processor for High-Density Neural Interfaces.
Proceedings of the 15th IEEE International Conference on ASIC, 2023
2022
Sensors, 2022
Proceedings of the IEEE International Reliability Physics Symposium, 2022
2021
NS-MD: Near-Sensor Motion Detection With Energy Harvesting Image Sensor for Always-On Visual Perception.
IEEE Trans. Circuits Syst. II Express Briefs, 2021
Analog Sensing and Computing Systems with Low Power Consumption for Gesture Recognition.
Adv. Intell. Syst., 2021
2019
Structure-Property Relationships in Graphene-Based Strain and Pressure Sensors for Potential Artificial Intelligence Applications.
Sensors, 2019
A 1.8mW Perception Chip with Near-Sensor Processing Scheme for Low-Power AIoT Applications.
Proceedings of the 2019 IEEE Computer Society Annual Symposium on VLSI, 2019
Energy-efficient Analog Processing Architecture for Direction of Arrival with Microphone Array.
Proceedings of the 2019 IEEE Computer Society Annual Symposium on VLSI, 2019
Proceedings of the 2019 IEEE Computer Society Annual Symposium on VLSI, 2019
2017
From "MISSION: IMPOSSIBLE" to mission possible: Fully flexible intelligent contact lens for image classification with analog-to-information processing.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2017
2016
Compliance current dominates evolution of NiSi<sub>2</sub> defect size in Ni/dielectric/Si RRAM devices.
Microelectron. Reliab., 2016
2015
Cu-Al intermetallic compound investigation using ex-situ post annealing and in-situ annealing.
Microelectron. Reliab., 2015