Xing Wu

Orcid: 0000-0002-9207-6744

Affiliations:
  • East China Normal University, School of Communication and Electronic Engineering, Department of Electrical Engineering, Shanghai, China


According to our database1, Xing Wu authored at least 15 papers between 2015 and 2023.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Bibliography

2023
The Human Activity Radar Challenge: Benchmarking Based on the 'Radar Signatures of Human Activities' Dataset From Glasgow University.
IEEE J. Biomed. Health Informatics, April, 2023

Catching the Missing EM Consequence in Soft Breakdown Reliability in Advanced FinFETs: Impacts of Self-heating, On-State TDDB, and Layout Dependence.
Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

Microscopic Characterization of Failure Mechanisms in Long-Term Implanted Microwire Neural Electrodes.
Proceedings of the IEEE International Reliability Physics Symposium, 2023

A Spike-Sorting-Assisted Compressed Sensing Processor for High-Density Neural Interfaces.
Proceedings of the 15th IEEE International Conference on ASIC, 2023

2022
Flexible Pressure Sensor Array with Multi-Channel Wireless Readout Chip.
Sensors, 2022

Nanoscale Analysis of Breakdown Induced Crack Propagation in DTSCR Devices.
Proceedings of the IEEE International Reliability Physics Symposium, 2022

2021
NS-MD: Near-Sensor Motion Detection With Energy Harvesting Image Sensor for Always-On Visual Perception.
IEEE Trans. Circuits Syst. II Express Briefs, 2021

Analog Sensing and Computing Systems with Low Power Consumption for Gesture Recognition.
Adv. Intell. Syst., 2021

2019
Structure-Property Relationships in Graphene-Based Strain and Pressure Sensors for Potential Artificial Intelligence Applications.
Sensors, 2019

A 1.8mW Perception Chip with Near-Sensor Processing Scheme for Low-Power AIoT Applications.
Proceedings of the 2019 IEEE Computer Society Annual Symposium on VLSI, 2019

Energy-efficient Analog Processing Architecture for Direction of Arrival with Microphone Array.
Proceedings of the 2019 IEEE Computer Society Annual Symposium on VLSI, 2019

Design of Switched-Current Based Low-Power PIM Vision System for IoT Applications.
Proceedings of the 2019 IEEE Computer Society Annual Symposium on VLSI, 2019

2017
From "MISSION: IMPOSSIBLE" to mission possible: Fully flexible intelligent contact lens for image classification with analog-to-information processing.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2017

2016
Compliance current dominates evolution of NiSi<sub>2</sub> defect size in Ni/dielectric/Si RRAM devices.
Microelectron. Reliab., 2016

2015
Cu-Al intermetallic compound investigation using ex-situ post annealing and in-situ annealing.
Microelectron. Reliab., 2015


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